KYOCERA AVX expands high-temperature transient protection components to support growing 48V vehicle architectures, addressing electrical stress, space constraints, and reliability in automotive electronics.

Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.

Kyocera introduces an OSFP-XD optoelectronic module supporting PCIe 6.0 optical interconnects to increase bandwidth and reduce power consumption in data center architectures.

New MLCC values and higher voltage ratings target signal integrity requirements in optical communications, RF front ends and mmWave electronics.

Kyocera Corporation has developed a sub-millimetre meta-lens that shifts focal position by wavelength, supporting compact optical systems and a wearable aerial display prototype.

The KGP Series delivers high capacitance, low ESR/ESL, and durable metal lead frames for miniaturised, sustainable, and high-frequency industrial, energy, and downhole applications.

Features double shielding for superior EMI suppression, supports PCIe Gen3 (8 Gbps) and USB 3.2 Gen2 (10 Gbps), with 30% higher retention.

Tool-free, poke-home design delivers durable, high-integrity connections for lighting and industrial applications.

New 6780-000 Series SPE connectors reduce system complexity and size while enabling power and data over a single twisted pair.

New thin-film couplers offer high RF performance, 1W power handling, and compact size for next-gen wireless systems.