Improved ultra-compact design for greater space savings in battery-driven IoT equipment and drones

ROHM's first, most advanced MUS-IC series DAC chip enables expressive playback of classical music.

As of April 1st, 2021, ROHM Semiconductor Europe appoints Wolfram Harnack as the company's new President. The former President, Toshimitsu Suzuki, will lead the European Sales Division as General Manager from April 1st from the company's headquarters in Japan. Wolfram Harnack joined ROHM Semiconductor Europe GmbH as Managing Director in October 2020.

ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000 nodes in a mesh network.

ROHM Semiconductor today announced that Embedded Artists, the producer of embedded SoMs and boards for use in industrial systems and as development platforms, is using a highly integrated PMIC from ROHM together with NXP’s i.MX 8M Nano processor on its iMX8M Nano uCOM board to deliver a robust and cost-effective solution for industrial applications. ROHM’s BD71847AMWV is a system PMIC for i.MX 8M Nano, as well as 8M Mini.

Latest Generation Solar Inverter Chargers ‘Powered By ROHM’.

ROHM introduces a new ultra-compact side-emitting (side view) infrared LED, CSL1501RW. The device is ideal for head-mounted displays, industrial headsets, and VR/MR/AR (xR, virtual reality) gaming systems.

ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant started in February 2019 to enhance the production capacity of SiC power devices.

Reducing initial data writing time by 30% and shortening time-to-shipment.

ROHM introduces the availability of a “2 channel high-speed ground sense CMOS op amp”, BD77502FVM, optimized for consumer and industrial equipment requiring high-speed sensing – such as industrial measurement and control systems.