Toshiba and SICC have signed an MOU to improve the quality and characteristics of SiC power semiconductor wafers, ensuring a stable supply for the growing demand in AI data centers.

Toshiba launches the new TLX9161T automotive photorelay, a small-sized device with a high output withstand voltage of 1500V for use in modern automotive battery systems.

The TLP579xH series, a rail-to-rail output device, enables efficient switching with less voltage drop, ideal for low-voltage applications or full-range signal processing.

Toshiba's new 80V and 150V MOSFETs achieve ~21% lower on-resistance and ~15% lower thermal resistance compared to existing models.

Toshiba introduces new AEC-Q100 compliant 2-channel automotive standard digital isolators, enhancing safety and reliability for HEV/EV on-board chargers.

New technology is expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.

Low figure of merit (RDS(ON) x Qgd) contributes to higher efficiency, pushing the performance envelope of high-voltage power system designs.

The TLP5814H gate driver photocoupler will boost SiC MOSFET safety, reduces size and cost, and ensures reliable high-temperature operation.

Toshiba highlights advanced SiC, MOSFET, and motor control technologies designed to enhance system efficiency, sustainability, and e-mobility solutions across industries.

The Inverter shield will enable efficient, precise three-phase BLDC motor control with wide voltage range, real-time monitoring, safety features, and software support.