TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.

Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.

TRUMPF increases efficiency and precision in chip production with the TruPlasma RF Series G3, web-based control, real-time monitoring, and pulse frequencies up to 400 kHz.

The companies are developing a new manufacturing process for more affordable microchips, combined laser etching process enables advanced packaging with glass instead of silicon.

Key innovations for the next generation of high-performance optical transceivers.

Demonstration at TRUMPF booth. Performance optimized for short reach (SR) using TRUMPF VCSEL inside Optomind’s transceiver. TRUMPF and Optomind strengthen partnership.

TRUMPF’s 980nm VCSEL extends transmission reach to 500 meters using optimized multimode fiber.

TRUMPF showcases advancements in datacom VCSELs and photodiodes, demonstrating great progress in long-wavelength VCSELs and 100G developments, and demonstrating 100G datacom VCSELs for high-speed optical data communication.

Dr. Thomas Dobbertin will become the new Managing Director of TRUMPF Photonic Components, succeeding Dr. Berthold Schmidt, who will become CTO and member of the Managing Board.

TRUMPF Photonic Components is showcasing two manufacturing solutions from its TruHeat VCSEL product series for Li-battery manufacturing at the Battery Show Europe.