Join the 155,000+ IMP followers

electronics-journal.com

High-temperature NTC thermistors expand automotive sensing capabilities

TDK Corporation introduces new NTCSP thermistors designed for conductive-glue mounting and operation up to +175 °C, supporting high-temperature automotive power electronics and advanced sensing applications.

  www.tdk.com
High-temperature NTC thermistors expand automotive sensing capabilities

TDK Corporation has expanded its NTCSP series of NTC thermistors with new components engineered for operation in high-temperature environments up to +175 °C. Mass production began in February 2026. The devices target demanding applications in automotive electronics and power semiconductor systems, where increasing performance requirements are driving higher thermal loads.

Supporting next-generation automotive power electronics
As automotive systems integrate more powerful power semiconductors, associated electronic components must tolerate elevated operating temperatures. The new NTCSP series extends TDK’s previous maximum guaranteed operating temperature from +150 °C to +175 °C, addressing thermal management challenges in applications such as anti-lock braking systems (ABS), transmissions, and engine control environments.

The thermistors comply with the AEC-Q200 reliability standard for automotive electronic components and provide a wide operating temperature range from −55 °C to +175 °C. They are designed for temperature detection and compensation across low- and high-temperature conditions, supporting stable system performance.

Conductive-glue mounting for high-temperature reliability
A key design feature is the use of AgPd (silver-palladium) terminals, enabling conductive-glue mounting instead of traditional soldering. This approach improves thermal durability and allows reliable operation at higher temperatures that can be difficult to achieve with conventional solder-mounted components.


High-temperature NTC thermistors expand automotive sensing capabilities

Compact design and integration flexibility
The NTCSP series is available in 10 kΩ and 100 kΩ variants within a compact 1.6 × 0.8 mm package, supporting space-constrained designs typical of modern automotive electronic modules. The components are suitable for integration into systems requiring precise temperature monitoring, especially in high-density power electronics.

Ongoing development roadmap
TDK indicates that further development of the NTC thermistor portfolio will focus on expanding chip sizes, thermistor characteristics, and operating temperature ranges to meet evolving requirements in automotive and industrial electronic applications.

www.tdk.com

  Ask For More Information…

LinkedIn
Pinterest

Join the 155,000+ IMP followers