Würth Elektronik at PCIM Europe 2026

Würth Elektronik eiSos and Würth Elektronik ICS are combining their respective portfolios in electronic components and power distribution to address the increasing thermal and current-density requirements in industrial automation and power electronics. This cooperation focuses on the integration of high-frequency inductors, thermal management hardware, and high-current contact systems.

Technical Synergy in Power Distribution
The partnership addresses the technical challenges of modern DC/DC conversion and line filtering. Würth Elektronik eiSos provides high-frequency inductors utilizing specialized core materials designed to enhance efficiency beyond standard ferrite-based components. These are deployed alongside flat-wire high-current inductors to minimize DC resistance and optimize performance in compact digital infrastructure.

To complement these passive components, Würth Elektronik ICS implements lead-free Powerelements, specifically the LF PowerBasket. This pluggable contact system is rated for currents up to 150 A and is engineered with high positional tolerance and low mating forces. These mechanical parameters allow for reliable, reversible board-to-board connections in modular industrial systems where vibration resistance and process stability are critical.

Thermal Management and PCB Protection
Effective heat dissipation is a central requirement for high-power density applications. The companies have developed a combined approach using new lines of heat sinks and specialized PowerBusbars. The PowerBusbar PF system utilizes vertically press-fit busbars that function as cooling fins. By integrating these directly into the PCB architecture, the system increases local current-carrying capacity while simultaneously improving thermal dissipation via vertical air convection.

Furthermore, the cooperation includes reference designs developed in conjunction with integrated circuit (IC) partners. These designs demonstrate the practical application of specialized ferrites for protecting PCBs against high inrush currents, ensuring electromagnetic compatibility (EMC) and operational longevity in transient-heavy environments.

Implementation and Knowledge Transfer
The integrated solutions will be demonstrated at PCIM Europe in Nuremberg (June 9–11, 2026), specifically at Booth 306, Hall 6. The technical implementation of these systems is supported by expert-led seminars focusing on industrial interface robustness and transient protection strategies.

Technical presentations scheduled for the event, including sessions on industrial interfaces by Dr. Heinz Zenkner and AI-driven trends in electronics by Alexander Gerfer, will detail the operational logic behind these hardware integrations. This collaborative approach allows engineers to source validated, interoperable components for high-current paths and thermal management from a single technical ecosystem.

Edited by Evgeny Churilov, Induportals Media - Adapted by AI.

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