STMicroelectronics Unveils Compact Intelligent Power Modules for Appliances

STMicroelectronics has launched a new series of small low-loss intelligent molded modules (SLLIMM) featuring direct-bonded copper (DBC) technology for industrial drives, air conditioners, heat pumps, and home appliances. The new modules deliver a complete 600V, 3-phase IGBT inverter bridge within a compact 18.8 x 32.8 mm footprint—representing a size reduction of more than 30% compared to existing IGBT Intelligent Power Modules (IPMs) in DBC packages.

The first device in the new SLLIMM Compact series, the 20A STGI15C60S, is optimized for low- to medium-power motor drive designs operating at switching frequencies up to 20kHz. The thermally efficient, fully isolated package (rated at 2000 Vrms/min) integrates trench-gate IGBTs, fast soft-recovery freewheeling diodes, two control ICs, a bootstrap diode, and comprehensive protection circuitry. Safety features include undervoltage lock-out (UVLO), a smart shutdown mechanism for fault conditions, and an embedded temperature sensor. The STGI15C60S is currently in production in a CDIPB-26L DBC package.

Additional Context
This section provides technological and market background not explicitly detailed in the original release.

Driven by stringent global energy efficiency regulations, the white goods and HVAC industries are rapidly transitioning from traditional fixed-speed on/off motors to variable-frequency drives (VFDs) that precisely control motor speed based on demand. An Intelligent Power Module (IPM) simplifies this transition by packaging the complex high-voltage power switches (IGBTs) and their delicate logic-level gate drivers into a single, reliable component. The use of Direct-Bonded Copper (DBC) packaging is particularly critical here; it consists of a ceramic substrate with copper directly bonded to both sides, offering exceptionally high thermal conductivity and electrical isolation. This efficient thermal management allows the heat generated by the fast-switching IGBTs to be drawn away from the silicon die quickly, enabling manufacturers to drastically shrink the size of the motor controller board while maintaining reliability in space-constrained appliances.

Edited by Lekshman Ramdas, Induportals editor – adapted by AI.

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