SECO to showcase Dragonwing IQ8 Edge AI module at electronica 2026

SECO will present its modular hardware and Edge AI technologies, including the SOM-SMARC-Dragonwing-IQ8, at electronica 2026 in Munich, Germany, from November 10 to 13. Through live demonstrations, conference sessions, and partner showcases, the company will illustrate how its hardware, AI development tools, and lifecycle software support OEMs in building, deploying, and managing intelligent connected products at scale.

Integrated Edge AI and deployment workflows
At the Edge Lab LIVE! zone (Hall C5, Booth 100/42), SECO will demonstrate its integrated hardware and software ecosystem. Utilizing a Modular Vision QCS6490 HMI, the showcase will map the complete AI journey—from selecting a pre-trained application in the SECO App Hub, configuring it within Clea Studio AI, and deploying it via the Clea IoT framework.

The booth will also highlight the SOM-SMARC-Dragonwing-IQ8, a SMARC^® Rel. 2.2 system-on-module powered by Qualcomm^® Dragonwing™ IQ8 Series technology. Featuring a Qualcomm Hexagon neural processing unit that delivers up to 40 TOPS of AI acceleration, the module is optimized for compute-heavy edge workloads such as industrial vision, robotics, and intelligent human-machine interfaces.

From Arduino prototyping to industrial scale
Through the "Works with Arduino" program, SECO offers a streamlined path for engineers transitioning from the Arduino VENTUNO Q prototyping board to a production-ready industrial SMARC design built on the same hardware and software foundation. SECO supports this integration with guidance on carrier-board design and I/O mapping. Once deployed, SECO's Clea OS ensures secure device management, over-the-air (OTA) software updates, and ongoing security maintenance across massive device fleets.

In addition to the main booth, the SOM-SMARC-Dragonwing-IQ8 will be featured in a digital showcase at Arrow’s stand (Hall C4, Booth 420) and within the Arduino area at CODICO’s booth. During the event, SECO executives will also take the stage: Chief AI and IoT Officer Fausto Di Segni will discuss scaling embedded innovation from "Makers to Millions," while Product & Marketing Program Manager Matteo Del Balio will present on CRA-ready edge deployment and vulnerability management using Clea OS.

Additional Context: Qualcomm Dragonwing IQ8 and the SMARC standard
This section details technical specifications and competitive benchmarking not included in the original product announcement.

The Qualcomm Dragonwing IQ8 Series is specifically engineered for demanding industrial environments, featuring an 8-core Kryo Gen 6 CPU, an Adreno 623 GPU, and support for an extended junction temperature range of -40°C to +125°C. Built to handle concurrent compute and AI workloads for robotics and intelligent edge devices, the processor integrates a dedicated real-time MCU subsystem and Ethernet with Time-Sensitive Networking (TSN). By standardizing this processing power onto a compact SMARC (Smart Mobility ARChitecture) module, SECO allows OEMs to decouple the core compute and memory components from application-specific I/O carrier boards. This modular approach drastically reduces hardware development time and provides a future-proof upgrade path, enabling engineers to swap or upgrade the processor module as AI demands increase without redesigning the entire physical system architecture.

Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.

www.seco.com