Murata teams with industry leaders to commercialize global LTE-M1/NB1 IoT solution to enable rapid deployment of new IoT products

In conjunction with Sony Semiconductor Israel (Sony, formerly Altair Semiconductor), STMicroelectronics, and Truphone, Murata today introduced the availability of the Type 1SE module, a highly integrated, miniaturized, low power cellular IoT solution featuring a low power STM32L4 MCU and an ALT1250 M1/NB modem.

Measuring just 15.4 × 18.0 × 2.5 mm, it combines four key components that enable fast and low-cost product development: STMicroelectronics’ ultra-low power STM32L462RE/Arm^® Cortex^®-M4 core with 512 KB Flash and 160KB SRAM MCU, Sony’s Altair ALT1250 solution-based low-power LTE Cat M1/NB1 modem and integrated SIM. Further, it is preloaded with Truphone’s SIM profile, allowing the module to operate worldwide – the first of its kind to do so.

Ideal for numerous IoT applications, the Type 1SE is certified as a host device to ease integration challenges. It lessens development time given that the end device can use the regulatory, GCF and carrier certificate already incorporated for the 1SE module. This collaboration also brings the STM32Cube Expansion (X-CUBE) for cellular software suite and substantial support via software development forums.

“By teaming with other industry leaders, we developed a true global connectivity solution that enables customers to realize their IoT products. With unprecedented optimization and flexibility, this module delivers unparalleled size, power, and cost efficiency. Further, the 1SE’s high level of integration drastically decreases and simplifies time to market,” stated Akira Sasaki, General Manager – IoT Group, Murata.

“Nowadays, more and more devices are connected using LPWA technology due to ubiquitous coverage and competitive total cost of ownership. This new solution offers simplicity and that enables rapid connectivity of devices to the cloud on a global scale,” said Dima Feldman, VP Product Management and Marketing at Sony Semiconductor Israel.

“Cellular connectivity will take a significant share of the IoT market, and that is why ST has teamed with a reliable player like Murata on a module powered by STM32L4 and embedded ST4SIM eSIM,” said Hakim Jaafar, Head of Wireless MCU Marketing, STMicroelectronics.

“At Truphone, we’ve long believed that the better the world connects, the better the world. And we hold that same belief for IoT. The potential for IoT growth is huge, but we cannot get there without seamless connectivity and a global reach. We’re thrilled to be teaming up with some of the best in the industry to bring this to the table for the Type 1SE module,” added Oliver Potter, Director of IoT at Truphone.

All four companies will come together on Thursday, April 29 at 2:00 PM EDT for a webinar to cover cellular IoT trends and share insight about enabling new markets, such as integrating the new 1SE module into devices. To register, visit here.

www.murata.com

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