Nexperia surface-mount device passes Board Level Reliability requirements for automotive application

Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit.

Nexperia, the expert in essential semiconductors, has announced that one of its surface-mount device packages - the clip-bond FlatPower package CFP15B - has, for the first time, passed Board Level Reliability (BLR) testing for automotive applications by a leading Tier 1 supplier. Initially, it will be used in an engine control unit.

BLR provides a means of evaluating the robustness and reliability of semiconductor packages. The rigorous testing procedure is especially relevant in automotive applications, where safety and reliability are critical. Accreditation is particularly important as the industry shifts towards more electric and connected vehicles, increasing the complexity of onboard electronic systems.

“BLR verification is an important milestone,” said Guido Söhrn, Nexperia’s Product Manager for Power Bipolar Discretes. “The CFP15B represents the latest generation of thermally-enhanced, ultra-thin surface-mount devices. Its versatility and reliability make it the perfect choice for automotive components such as engine control units, transmission control units and many other safety applications such as braking.”

BLR verification confirmed that CFP15B exceeded twice the level of reliability performance that would be expected in accordance with AEC-Q101. Power temperature cycles, combining temperature cycling and intermittent operating life tests, saw the device achieve a qualification of 2,600 cycles. “The automotive sector presents some tough applications for surface-mount devices, and CFP15B proved itself under the harshest conditions,” added Guido Söhrn.

The CFP15B is manufactured from the highest-grade materials. It provides zero delamination in the areas around the leads, die and clip, therefore eliminating moisture ingress and increasing reliability.

CFP15B’s thermal resistance is reduced by featuring a solid copper clip. This optimizes the transfer of heat into the PCB, allowing compact PCB designs. The device is up to 60 per cent smaller than DPAK and SMx packages, with no compromise on thermal behavior. The small sizing presents huge space-saving options and therefore increases design flexibility.

The device package is used by different power diode technologies such as Nexperia’s Schottky or recovery rectifiers but can also be extended to Silicon Germanium power diodes or bipolar transistors.

It offers significant product diversity, covering single/dual configuration and between 4-20 A, simplifying board design.

For more information visit www.nexperia.com/cfp
You can also view Nexperia’s power diode technologies and CFP15B in action at Nexperia’s Power Live Event 21 – 23 September www.nexperia.com/power-live

www.nexperia.com

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