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Micron Announces New Semiconductor Assembly and Test Facility in India

Micron plans to build a new assembly and test facility in Gujarat, India, for manufacturing DRAM and NAND products, catering to domestic and international market demands.

Micron Announces New Semiconductor Assembly and Test Facility in India

Phased construction of the new assembly and test facility in Gujarat is expected to begin in 2023. Phase 1, which will include 500,000 square feet of planned cleanroom space, will start to become operational in late 2024, and Micron will ramp capacity gradually over time in line with global demand trends. Micron expects Phase 2 of the project, which would include construction of a facility similar in scale to Phase 1, to start towards the second half of the decade.

Micron’s investment will be up to $825 million over the two phases of the project and will create up to 5,000 new direct Micron jobs and 15,000 community jobs over the next several years. Under the government's “Modified Assembly, Testing, Marking and Packaging (ATMP) Scheme,” Micron will receive 50% fiscal support for the total project cost from the Indian central government and incentives representing 20% of the total project cost from the state of Gujarat.

The combined investment by Micron and the two government entities over the course of both phases will be up to $2.75 billion. Government support will help fund the project and facilitate access to essential semiconductor infrastructure and resources to drive innovation and enhance local talent development.

Micron’s plans are part of the company’s strategy to meet expected long-term demand for memory and storage across markets and complement the company’s global assembly and test network. Micron selected the state of Gujarat due to its manufacturing infrastructure, conducive business environment and a well-established talent pipeline in the SANAND Industrial Park (Gujarat Industrial Development Corporation – GIDC). Micron’s new facility will focus on transforming wafers into ball grid array (BGA) integrated circuit packages, memory modules and solid-state drives.

Micron will build and operate the assembly and test facility in accordance with the company’s sustainability goals and in line with local and global environmental commitments. Micron is committed to designing and building the facility to meet or exceed Leadership in Energy and Environmental Design (LEED) Gold standards. Additionally, the facility will use advanced water-saving technologies to enable Zero Liquid Discharge.

www.micron.com

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