Rutronik introduces MLCCs from KEMET using KONNEKTTM technology, offering a unique composition with special conductivity
KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.
With TLPS, KEMET offers surface-mountable multiple-chip solution for high-density packaging.
The surface-mount U2J, KC-LinkTM, and C0G capacitors are primarily designed for power applications with high efficiency and high packing density. KEMET's X7R series capacitors are used when higher capacitances and voltages are required additional space on the PCB. The capacitors (U2J, KC-LinkTM, X7R, and C0G) are available with case sizes 1812, 2220 and 3640.
KONNEKTTM technology uses an innovative TLPS (Transient Liquid Phase Sintering) material in which a low melting point metal or alloy reacts at low temperature with a high melting point metal or alloy to form a reactive metal matrix. The result is a highly conductive interconnect material that can be used to join multiple MLCCs. The result is stacked "multi-chip" devices without lead frames that can be aligned horizontally and vertically. This makes it easy to reduce the space required on the PCB.
Benefits at a glance:
- Space saving on the PCB
- Low ESR and ESL
- High ripple current
- Commercial and automotive quality
- C0G(NP0), U2J(N750) and X7R dielectrics
- Wide temperature range from -55 °C up to +150 °C
Other applications:
- Wide bandgap (WBG), silicon carbide (SiC), and gallium nitride (GaN) based systems.
- Data centres
- EV/HEV (drive systems, charging)
- LLC resonant converters
- Switched tank converters
- Wireless charging systems
- Photovoltaic
- Power converters
- Inverter
- DC link
- Snubber
For more information about the KONNEKTTM MLCC portfolio by KEMET and a direct ordering option, please visit our e-commerce platform at www.rutronik24.com.
www.rutronik.com
