electronics-journal.com
24
'24
Written on Modified on
Broadcom News
BROADCOM DELIVERS INDUSTRY-LEADING 200G/LANE DSP FOR GEN AI INFRASTRUCTURE
Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.
www.broadcom.com
Broadcom announced the general availability of Sian™2, 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. Sian2 features 200G/lane electrical and optical interfaces to augment the Sian DSP that supports 100 Gbps electrical and 200Gbps optical interfaces. Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next-generation AI clusters.
AI cluster sizes and cluster performance needs are growing dramatically to support exploding AI model sizes. High performance, low latency, and resilient connectivity are vital for the scale-up and scale-out of next-generation AI clusters. For these networks, customers demand reliable optical network connectivity with higher bandwidth, lower power, lower latency and lower cost. This necessitates the migration from the 400G/800G links with 100G/lane optics being used in AI clusters today to 800G/1.6T links with 200G/lane optics that Sian2 enables. Broadcom’s Sian2 and Sian DSPs are optimized for 800G and 1.6T optical module platforms and deliver unmatched performance by doubling the bandwidth with lower power, lower latency and lower cost per bit to facilitate AI data center scale.
Further, the combination of Sian2 and Sian PHY and Broadcom’s leading-edge 200G/lane optics, including electro-absorption modulated laser (EML) and continuous wave laser (CWL), provides the best-in-class performance and power consumption enabling data center operators to cost-effectively scale AI workloads.
Sian2 Product Highlights:
- Low power 5nm 200G/lane DSP solution enabling sub-28W 1.6T transceivers
- Supports 800G and 1.6T pluggable modules
- Support for both 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet applications
- Support for multiple FEC options including Bypass, Segmented and Concatenated FEC
- Built-in low-swing and high-swing laser driver for both SiP and EML-based optical modules
- Sub-80ns roundtrip (Ingress + Egress) latency for AI/ML applications
- Crossbar support for ease of transceiver design
Demo Showcase at ECOC 2024
Broadcom Sian2 PHY and 200G/lane optics inside 1.6T DR8 optical modules will be demonstrated in the Innolight Booth B81 and Eoptolink Booth D60 taking place at ECOC Exhibition 2024, in Frankfurt, Germany from September 23-25. Attendees will see live transmit eye performance and end-to-end pre-FEC & post-FEC performance with IEEE-compliant KP4 FEC.
Learn more
Broadcom Sian2 PHY and 200G/lane optics inside 1.6T DR8 optical modules will be demonstrated in the Innolight Booth B81 and Eoptolink Booth D60 taking place at ECOC Exhibition 2024, in Frankfurt, Germany from September 23-25. Attendees will see live transmit eye performance and end-to-end pre-FEC & post-FEC performance with IEEE-compliant KP4 FEC.
Learn more
