Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024
FinFastTM-enabled Crescendo platform relocates power conversion underneath the xPU processor for immediate computing performance, density and efficiency gains.
Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), will demonstrate its new Crescendo platform with FinFast™ technology at electronica 2024, the world’s leading trade fair and conference for electronics. Experience the first demonstration in Europe of scalable true vertical power for artificial intelligence (AI) and high-performance computing (HPC) by visiting Empower Semiconductor (Dimac Red S.p.A.) at Hall B4, Booth #110 on the show floor at the Messe München, November 12-15, 2024.
The Crescendo platform – a scalable on-demand true vertical power architecture for upwards of 3,000A power domains – integrates all power components in a single device thin enough to relocate underneath the processor and supply on-demand kilowatt power with unmatched speed and accuracy. It eliminates virtually all capacitor banks, shrinking board space by 5x and reducing system power losses by up to 20%.
Designed to address the pressing power delivery challenges of AI processors, Crescendo harnesses Empower’s FinFastTM technology to offer a unique integration of advanced silicon processes, magnetics and silicon capacitors with breakthrough control architectures in a thermally-efficient power package.
“Bringing Crescendo to electronica is an important and proud milestone for Empower,” stated Eric Pittana, senior director of global marketing and EMEA sales for Empower Semiconductor. “Following the strong reception we received during the unveil in the U.S. market in October, we’re eager to demonstrate to our European customers how Crescendo is the answer to their kilowatt-range power delivery problem.”
www.empowersemi.com
