05 {{ "2020-03-05T00:00:00+00:00" | date "MMM" }} '20

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TDK News

600W Class I and Class II 3”x 5” medical and industrial power supplies offer efficiencies up to 96%

TDK Corporation (TSE 6762) announces the introduction of the 600W rated TDK-Lambda brand CUS600M series of AC-DC power supplies. With efficiencies of up to 96% internal heating is minimised, allowing reliable operation in the industry standard 3” x 5” footprint.

Read more…

05 {{ "2020-03-05T00:00:00+00:00" | date "MMM" }} '20

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Röhm News

Cutting-Edge Web Simulation Tool Capable of Complete circuit Verification for Power Devices and ICs

New tool enables easy verification of solution circuits using the SystemVision portfolio cloud environment from Mentor, a Siemens business.

Read more…

04 {{ "2020-03-04T00:00:00+00:00" | date "MMM" }} '20

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Leuze

New type of contour measurement

With the new CMS 700i 3D contour measurement system, Leuze electronic is presenting a world’s first for volume measurements: a complete solution for the fault-free storage of goods that can be autonomously commissioned and maintained by the customers via WebConfig.

Read more…

03 {{ "2020-03-03T00:00:00+00:00" | date "MMM" }} '20

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ONSEMI news

ON Semiconductor Announces Innovative New USB-C PD 3.0 Controllers with Advanced Feature Sets and Enhanced Efficiency

New USB-C Power Delivery (PD) 3.0 Devices provide market-leading solutions for power adapter and battery charger applications.

Read more…

03 {{ "2020-03-03T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-03-03T00:00:00+00:00" | date "longDate" }}

Elesa + Ganter News

Indexing plungers with position signal

Indexing plungers very often fulfill safety functions – but this is not the only time when it is important to obtain feedback about their position. With the new series GN 817.6, Elesa+Ganter now also allows automated status checks.

Read more…

02 {{ "2020-03-02T00:00:00+00:00" | date "MMM" }} '20

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TDK News

New Data Book for aluminum electrolytic capacitors

TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.

Read more…

02 {{ "2020-03-02T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-03-02T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba announces new cutting-edge CMOS silicon on insulator process

New process will enhance the noise figure of RF switches and low noise amplifiers for 5G and Wi-Fi applications.

Read more…

02 {{ "2020-03-02T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-03-02T00:00:00+00:00" | date "longDate" }}

Stemmer imaging News

Easy 3D Plug & Play with Zivid One+

STEMMER IMAGING has extended its portfolio with the Zivid One+ 3D colour cameras from the Norwegian supplier Zivid since summer 2019. Our product manager Tim Huylebrouck describes his first experience with the 3D cameras.

Read more…

02 {{ "2020-03-02T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-03-02T00:00:00+00:00" | date "longDate" }}

Hexagon AB News

Hexagon launches new entry-level optical CMM for the Asia-Pacific region

Captura is an easy to use CMM that provides multisensor measurement at an affordable price point.

Read more…

28 {{ "2020-02-28T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-02-28T00:00:00+00:00" | date "longDate" }}

Kontron News

COM-HPC - Higher performance for Computer-on-Modules

Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC:

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White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

600W Class I and Class II 3”x 5” medical and industrial power supplies offer efficiencies up to 96%

TDK Corporation (TSE 6762) announces the introduction of the 600W rated TDK-Lambda brand CUS600M series of AC-DC power supplies. With efficiencies of up to 96% internal heating is minimised, allowing reliable operation in the industry standard 3” x 5” footprint.

Cutting-Edge Web Simulation Tool Capable of Complete circuit Verification for Power Devices and ICs

New tool enables easy verification of solution circuits using the SystemVision portfolio cloud environment from Mentor, a Siemens business.

New type of contour measurement

With the new CMS 700i 3D contour measurement system, Leuze electronic is presenting a world’s first for volume measurements: a complete solution for the fault-free storage of goods that can be autonomously commissioned and maintained by the customers via WebConfig.

ON Semiconductor Announces Innovative New USB-C PD 3.0 Controllers with Advanced Feature Sets and Enhanced Efficiency

New USB-C Power Delivery (PD) 3.0 Devices provide market-leading solutions for power adapter and battery charger applications.

Indexing plungers with position signal

Indexing plungers very often fulfill safety functions – but this is not the only time when it is important to obtain feedback about their position. With the new series GN 817.6, Elesa+Ganter now also allows automated status checks.

New Data Book for aluminum electrolytic capacitors

TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.

Toshiba announces new cutting-edge CMOS silicon on insulator process

New process will enhance the noise figure of RF switches and low noise amplifiers for 5G and Wi-Fi applications.

Easy 3D Plug & Play with Zivid One+

STEMMER IMAGING has extended its portfolio with the Zivid One+ 3D colour cameras from the Norwegian supplier Zivid since summer 2019. Our product manager Tim Huylebrouck describes his first experience with the 3D cameras.

Hexagon launches new entry-level optical CMM for the Asia-Pacific region

Captura is an easy to use CMM that provides multisensor measurement at an affordable price point.

COM-HPC - Higher performance for Computer-on-Modules

Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC:

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