Samsung's wireless charger uses electromagnetic induction for cable-free charging, supporting Qi standards, high power (up to 50W), efficiency, compatibility, and advanced in-band communication technology.

The exhibition will focus on Samsung’s advanced technologies, highlighting how they are driving new possibilities in diverse applications including HPC, server, data center, automotive and consumer electronics.

New GDDR7 offers industry-leading capacity and speed of over 40Gbps, significantly raising the bar for graphics DRAM powering future applications.

Integrating Samsung’s 5nm controller and eighth-generation V-NAND, PM9E1 provides unmatched performance and power efficiency suitable for AI PCs.

With capacities of up to 4TB, 73% better power efficiency and random read and write speeds of 1,050K IOPS and 1,400K IOPS respectively, the 990 EVO Plus offers the best-in-class SSD experience to consumers, workers and gamers alike.

Latest QLC V-NAND combines several breakthrough technologies, including Channel Hole Etching that enables the highest layer count in the industry with double stack structure.

HBM4 36GB Mechanical Test Vehicle (MTV), for use by OEM customers wanting to prepare for the advanced Samsung HBM4 36GB production devices coming in 2025.

New lineup features industry-leading 200MP and 50MP sensors, bridging the gap between main and sub cameras for enhanced imaging across all angles.

MRDIMM is expected to be actively adopted for AI applications that require High-Performance Computing (HPC) to process data and perform complex calculations at high speeds.

The introduction of V9 TLC V-NAND technology brings something more: a radical enablement of developer applications that suddenly, freed of storage limitations, are empowered to change the world.