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Samsung announces the availability of HBM4 36GB MTV in November 2024

HBM4 36GB Mechanical Test Vehicle (MTV), for use by OEM customers wanting to prepare for the advanced Samsung HBM4 36GB production devices coming in 2025.

  semiconductor.samsung.com
Samsung announces the availability of HBM4 36GB MTV in November 2024

The Samsung HBM4 36GB MTV is a fully functional prototype of the final HBM4 device, designed to be used for package assembly set-up, pre-qualification, and thermal pre-evaluation tests. It incorporates innovative architectural aspects such as cutting-edge Through-Silicon Via (TSV) and 12-high 3D package stack technologies to more realistically represent the operation of the final device.

The eventual production Samsung 36GB HBM4 device will provide improved power efficiency through utilization of advanced DRAM process technology on the core and SF4x (4 nm-class) logic process technology on the base die. Therefore, the Samsung HBM4 36GB MTV is based on these same technologies to allow customers to predict performance accurately, to pre-optimize package assembly set-up, and to meaningfully test thermal conditions.

Features and Benefits
JEDEC HBM4 compliance
Samsung HBM4 36GB MTV design is fully compliant to the key parameters listed in the JEDEC HBM4 specification.

Functional equivalence
To effectively prototype the eventual Samsung HBM4 36GB product, the Samsung HBM4 36GB MTV supports operation with a 2,048 I/O bus.

Stack density
The 36GB stack density of the MTV is 1.5x that of the previous generation HBM3E device.

Power supply
The process technology allows for qualification using a lower VDDQ power supply, a design scheme that is required by next-generation High-Performance Computing (HPC) and Artificial Intelligence (AI) systems.

Summary
The Samsung HBM4 36GB MTV is the world’s first prototype test vehicle to integrate state-of-the-art DRAM and logic processes. Its purpose is to aid industry partners to better comprehend the value propositions compared to previous HBM line-ups, and to accelerate package assembly and thermal condition set-up stages. This test vehicle will help industry stakeholders get ready for eventual HBM4 product evaluation and qualification – substantially reducing time-to-market.

www.semiconductor.samsung.com

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