Infineon Power Technologies Boost Anker’s New 160 W Charger
Infineon’s XDP hybrid-flyback controller and CoolGaN devices power Anker’s compact 160 W charger with enhanced efficiency, power density and system performance.
www.infineon.com
Infineon Technologies AG has expanded its collaboration with Anker, a leading manufacturer of fast-charging power devices, to develop a new generation of high-speed chargers that can deliver up to 160 Watts of power in a compact, pocket-size format. The result of the cooperation is redefining industry standards for high power density and efficiency, represented by the launch of Anker’s 160 W Prime Charger. The industry-leading device features Infineon’s latest XDP™ digital controller and gallium nitride (GaN) -based CoolGaN™ transistor technology, enabling a credit-card-size design, which makes the charger ideal for travelers and professionals alike.
“At Infineon, we believe that the key to unlocking the full potential of Anker’s charger technology lies in a full systems approach,” said Johannes Schoiswohl, Head of GaN Business Line at Infineon. “By designing and optimizing the entire system, including the GaN devices, drivers, and control units, we achieve unprecedented levels of efficiency, power density, and reliability in the chargers. Together with Anker, we strive to deliver high-performance, compact, and energy-efficient charging solutions that meet the demanding requirements of today’s mobile devices.”
Infineon’s digital control technology ensures precise energy management, while GaN based components excel in high-frequency and high-efficiency power conversion. By integrating power factor correction (PFC) and hybrid-flyback control (HFB) stages to minimize the size while improving the overall performance, the Infineon XDP XDPS2221E hybrid-flyback digital combo controller enhances the energy efficiency of the charger, delivering high-power density without sacrificing reliability. The technology allows up to 140 W power supply from any of the three USB-C single ports and allocating 160 W intelligently across three devices. Other key components include the CoolGaN Drive 700 V G5 with integrated driver and the CoolGaN Transistor Dual 650 V G5, which integrates two GaN transistors in a single package, reducing board space and optimizing layout.
By leveraging high-efficiency design, high frequency switching, soft-switch control, and digital combination control technology, along with multiple patented innovations, Infineon has optimized the overall system performance of the Anker Prime Charger. This has enabled the delivery of higher output capability within the same volume, while also reducing the number of peripheral components and lowering bill-of-material (BOM) costs.
This collaboration is strengthened by the established Innovation Application Center in Shenzhen by Infineon and Anker. The center serves as a hub for developing more energy-efficient and CO2-saving charging solutions, supporting decarbonization and driving innovation in the fast-charging sector.
Availability
Learn more about the XDP XDPS2221E hybrid flyback controller from Infineon here, and about CoolGaN power semiconductors here.
CES 2026
At CES 2026 in Las Vegas, Infineon will showcase its latest innovations, including the new 160 W Prime Charger, at The Venetian Resort Hotel with demos in the Venetian Tower Guest Suites 29-139.
www.infineon.com
