Infineon’s XDP hybrid-flyback controller and CoolGaN devices power Anker’s compact 160 W charger with enhanced efficiency, power density and system performance.

Combined HYPERRAM memory and controller IP enable high-bandwidth, low-power memory for MicroBlaze V RISC-V designs.

The lineup features PQC-ready TEGRION SLC27, advanced SECORA identity and payment platforms, plus biometric and sustainable solutions supported by FIDO authentication and live multi-trust demos.

New ASIL-D microcontroller adds intelligence to high-voltage BMS and supports zonal, software-defined vehicle architectures in partnership with Munich Electrification.

CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.

Infineon-led Mannheim-CeCaS unites 28 partners to develop modular, energy-efficient car server for autonomy advancement.

The new TLE994x and TLE995x SoCs integrate control, diagnostics, and security in one chip, supporting efficient, compact, and safe brushed and brushless motor applications.

Infineon's UWB lab in Graz with Silicon Austria Labs features motion-capture systems and centimeter-level precision for automotive, IoT, and industrial localization applications.

New CoolSiC MOSFET G2 modules deliver higher power density, extended lifetime, and improved thermal performance for demanding applications such as fast EV charging and energy storage.

The new IPOSIM feature enables realistic modeling of switching behavior, thermal dynamics, and gate driver effects, helping engineers optimize EV, solar, and industrial power designs efficiently.