This collaboration enables vertical power delivery modules saving 150 tons CO₂ per rack, supporting 1 MW AI data centers' growing demand.

New MCU family complies with CNSA 2.0 and PSA Level 3, enabling secure motor control and power conversion applications while easing the industry’s transition to the PQC era.

Integration of Infineon’s microcontrollers, sensors, and smart actuators with NVIDIA Jetson Thor delivers precise, efficient, and secure motion solutions for humanoid robots in manufacturing, logistics, and healthcare.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation.

Top-side-cooled CoolSiC G2 MOSFETs offer 25% lower switching losses, improved thermal performance, and compact design flexibility.

Infineon’s ID Key S USB combines a secure SLC38 controller and USB bridge in a certified system-in-package for robust hardware-based authentication and encryption.

Infineon’s XENSIV 3D magnetic Hall sensors offer ASIL-B support, ±160 mT range, and low power for high-precision positioning across multiple industries.

Chip production on 300mm wafers is technically more advanced and efficient than 200mm, yielding 2.3 times more chips per wafer.

Infineon’s new ID solutions offer flexibility, faster deployment, and innovative packaging to meet local eID project needs amid growing global digitalization demands.

Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.