XHP™ 2 1700 V IGBT5 modules with .XT interconnect enhance efficiency, reliability, and service life, enabling Goldwind’s 4.5 MW turbines to stabilize grids and lower energy costs.

Infineon’s 12kW PSU reference design combines CoolSiC/CoolGaN technologies for 99% efficiency and 113 W/in³ density in AI data centers.

New production-ready AUTOSAR drivers, safety libraries, and DSP tools accelerate ECU development and meet highest ASPICE, ISO26262, and ISO21434 standards.

This collaboration enables vertical power delivery modules saving 150 tons CO₂ per rack, supporting 1 MW AI data centers' growing demand.

New MCU family complies with CNSA 2.0 and PSA Level 3, enabling secure motor control and power conversion applications while easing the industry’s transition to the PQC era.

Integration of Infineon’s microcontrollers, sensors, and smart actuators with NVIDIA Jetson Thor delivers precise, efficient, and secure motion solutions for humanoid robots in manufacturing, logistics, and healthcare.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation.

Top-side-cooled CoolSiC G2 MOSFETs offer 25% lower switching losses, improved thermal performance, and compact design flexibility.

Infineon’s ID Key S USB combines a secure SLC38 controller and USB bridge in a certified system-in-package for robust hardware-based authentication and encryption.

Infineon’s XENSIV 3D magnetic Hall sensors offer ASIL-B support, ±160 mT range, and low power for high-precision positioning across multiple industries.