Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

Infineon provides semiconductor power management solutions for the NVIDIA modular MGX architecture to optimize energy distribution in high-density accelerated computing data centers.

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.

Infineon Technologies coordinates a 62-partner initiative to develop advanced power electronics systems utilizing heterogeneous integration and chiplet architectures for industrial applications.

The new silicon carbide module variants support 1500 V DC-link architectures in renewable energy and high-power conversion systems.

Infineon Technologies contributes industrial expertise to European quantum pilot lines to enable scalable quantum chip production and strengthen the regional semiconductor ecosystem.

Infineon components supported Artemis II mission systems, demonstrating reliability in power, control, and communication electronics under prolonged radiation exposure conditions.

Infineon Technologies maintains global leadership in automotive semiconductors, expanding microcontroller share and reinforcing its position across key regional markets.

Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.