Infineon’s ID Key S USB combines a secure SLC38 controller and USB bridge in a certified system-in-package for robust hardware-based authentication and encryption.

Infineon’s XENSIV 3D magnetic Hall sensors offer ASIL-B support, ±160 mT range, and low power for high-precision positioning across multiple industries.

Chip production on 300mm wafers is technically more advanced and efficient than 200mm, yielding 2.3 times more chips per wafer.

Infineon’s new ID solutions offer flexibility, faster deployment, and innovative packaging to meet local eID project needs amid growing global digitalization demands.

Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.

Security controllers are an essential part of modern digital life. They are embedded into ePassports, ID cards, payment cards, and smartphones, protecting the personal data and digital identities of billions of people worldwide.

The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.

Infineon and NVIDIA develop 800 V HVDC architecture to boost efficiency, reliability, and set new power delivery standards for AI data centers.

Infineon Technologies AG is introducing the CoolGaN bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions.

Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.