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Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3
The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.
www.vecow.com

As edge AI workloads continue to move closer to machines, sensors, and production environments, embedded systems are increasingly required to combine compute density, thermal efficiency, and long-term reliability in compact form factors. Vecow’s TGS-2000 Series addresses these requirements with a stackable industrial AI PC architecture built around the latest Intel Core Ultra Series 3 processors.
The platform is designed to support a broad range of edge AI use cases, including computer vision pipelines, generative and agent-based AI, and real-time analytics in industrial and infrastructure environments. By integrating CPU, GPU, and neural processing capabilities on a single processor platform, the system enables local AI inference without relying on external accelerators for many workloads.
Processor platform and AI performance
The TGS-2000 Series is powered by Intel Core Ultra Series 3 processors, delivering up to 100 platform TOPS through integrated CPU, GPU, and NPU resources. This heterogeneous compute architecture allows developers to distribute workloads efficiently, balancing AI inference, graphics processing, and general-purpose control tasks while maintaining predictable power consumption.
Such integration is particularly relevant for edge deployments where thermal headroom and energy efficiency are constrained, and where offloading data to centralized servers is impractical due to latency or bandwidth limitations.
Stackable expansion for edge system integration
A defining characteristic of the TGS-2000 Series is its stackable mechanical and electrical design. Expansion modules can be added to tailor the system for specific applications, including optional AI accelerators, additional USB interfaces, isolated digital I/O, serial connectivity, LAN expansion, or 4G/LTE communication. This modularity allows system integrators to scale functionality without redesigning the core platform.
High-speed I/O support includes USB 3.2 Gen 2, USB 3.2 Gen 2x2 Type-C, and dual 2.5 Gigabit Ethernet, enabling direct connection to cameras, sensors, and industrial networks. Wireless options such as 5G, Wi-Fi, Bluetooth, and LTE further support distributed and mobile edge deployments.
Industrial operating conditions and power design
The TGS-2000 Series is engineered for continuous operation in demanding environments. It supports a wide DC input range from 12 V to 24 V and is specified for operating temperatures from –25 °C to 55 °C, making it suitable for factory floors, roadside infrastructure, and outdoor enclosures.
Fanless and fan-equipped variants are available, allowing system designers to balance acoustic constraints, thermal dissipation, and maintenance considerations depending on deployment conditions.
Platform variants and deployment flexibility
The product family includes multiple configurations, ranging from fanless systems for compact installations to models supporting MXM GPU cards for higher graphics or AI acceleration requirements. Multi-display support via HDMI 2.1 and DisplayPort interfaces enables use in visualization-heavy applications such as machine monitoring, inspection stations, or control rooms.
By combining a modular hardware architecture with integrated AI processing and industrial-grade specifications, the Vecow TGS-2000 Series is positioned as a flexible building block for edge AI systems that must scale across performance levels while remaining stable over long deployment lifecycles.
www.vecow.com

