COM Express module brings Intel Core Ultra Series 3 to the edge
SECO introduces a new COM Express Type 6 module based on Intel Core Ultra Series 3 processors, targeting AI-driven industrial and embedded edge systems.
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SECO has launched the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module designed to give embedded developers early access to Intel Core Ultra Series 3 processors for edge computing. Announced following the processor debut at CES 2026 in Las Vegas, the module is positioned for applications requiring a combination of heterogeneous compute, AI acceleration, advanced graphics, and industrial-grade reliability.
Processor architecture and AI capabilities
Intel Core Ultra Series 3 processors introduce a redesigned hybrid architecture with up to 16 CPU cores, combining performance and efficiency cores for balanced compute density and power efficiency. The processors integrate Intel NPU 5, delivering up to 50 TOPS of dedicated AI acceleration. When combined with CPU and GPU resources, the platform can reach up to 180 TOPS, supporting complex inference workloads at the edge.
Graphics and imaging performance are handled by the integrated Intel GPU based on the Xe3 architecture, designed to improve throughput for vision processing, multi-display human–machine interfaces, and graphics-intensive workloads.
Module design and connectivity
SECO has implemented these capabilities within the COM Express Type 6 Basic form factor, providing a standardized and scalable building block for embedded system design. The SOM-COMe-BT6-PTL supports up to 128 GB of DDR5 memory via two SO-DIMM slots and offers high-speed I/O including PCIe Gen4 and Gen5, USB 4.0 / Thunderbolt, and 2.5 Gigabit Ethernet.
Multiple display interfaces, including eDP, DisplayPort, and HDMI, support advanced HMI designs and multi-camera vision systems. Optional industrial-temperature variants are available to address harsh operating environments and long lifecycle requirements typical of industrial automation and mission-critical deployments.
Target applications
The module is intended for latency-sensitive and compute-intensive edge use cases such as AI-enabled industrial automation, smart retail systems, medical imaging, advanced vision platforms, and multi-sensor data processing. By combining AI acceleration, graphics performance, and flexible I/O in a standardized COM Express platform, the module supports both rapid prototyping and scalable product development.
Software ecosystem and device management
The SOM-COMe-BT6-PTL integrates with SECO’s Clea framework for IoT, AI infrastructure, and device lifecycle management. Through Clea OS 2.0, a Yocto Project–based embedded Linux distribution, developers can deploy, monitor, update, and secure devices remotely. This software stack is designed to support fleet management at scale while simplifying compliance with European cybersecurity regulations such as the Cyber Resilience Act and the Radio Equipment Directive.
SECO is presenting the SOM-COMe-BT6-PTL at CES 2026 in Las Vegas, where visitors can review the module’s hardware capabilities and software integration options for next-generation edge AI systems.
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