ATP Electronics launches world’s smallest 6.7 mm e.MMC for next-generation smart wearables
Ultra-compact e.MMC delivers major size reduction, high power efficiency, and robust performance for space-constrained designs.
www.atpinc.com
ATP Electronics has unveiled the world’s smallest and first 6.7 mm e.MMC, setting a new benchmark for ultra-compact, power-efficient storage designed specifically for next-generation smart wearables.
Built on a 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions reduce footprint by 67% compared to standard e.MMC, while delivering up to 70% power savings. The new package further shrinks ATP’s previous 7.2 × 7.2 mm design introduced in early 2025, responding to growing demand from wearable applications such as smart glasses, where space, power consumption, and thermal control are critical.
Miniaturization without performance compromise
Despite its reduced size, the 6.7 mm e.MMC remains pin-to-pin compatible with JEDEC e.MMC 5.1 (JESD84-B51) and supports x1/x4/x8 bus modes with HS400 DDR, enabling bandwidths of up to 400 MB/s. ATP confirms that thermal behavior remains well controlled, ensuring reliability even in tightly packed designs.
The module’s 0.65 mm thin z-height is optimized for slim wearable form factors and integrates seamlessly with discrete LPDDR memory and major SoC platforms, supporting both ergonomic and aesthetic product requirements.
Power efficiency and endurance for wearable workloads
ATP’s advanced firmware enables Auto Power-Saving Mode, accelerating transitions from active to idle states. Combined with power optimization technologies, this delivers up to 70% power conservation, significantly extending battery life—an essential advantage for always-on wearable devices.
Capacity options are aligned with wearable market needs:
- 64 GB TLC with 12 TB endurance
- 20 GB pSLC (E700Pc) with up to 680 TB endurance for write-intensive workloads
Comprehensive data-integrity features include advanced error correction, wear leveling, Auto Refresh for read-intensive “hot zones,” and Dynamic Data Refresh for rarely accessed data areas.
Built for real-world wearable environments
The soldered-down design ensures vibration resistance, while support for a -25 °C to 85 °C operating range enables reliable use in mobile, outdoor, and demanding scenarios where smart wearables are continuously exposed to motion and temperature variation.
Customer-driven innovation
ATP is collaborating with leading global smart wearable manufacturers on proof-of-concept development and validation. By combining aggressive miniaturization, power efficiency, and endurance without sacrificing performance, ATP positions itself as the first—and currently only—supplier offering a 6.7 mm e.MMC tailored for advanced wearable designs.
Through flexible sampling, rapid prototyping support, and close engineering collaboration, ATP continues to push the limits of storage technology for space- and power-constrained applications.
www.atpinc.com
