80V Power MOSFETs Optimized for Automotive 48V Supply Systems

ROHM has released the AG16xFNxx series of 80V power MOSFETs engineered specifically for emerging automotive 48V power supply systems. This hardware provides a highly efficient, space-saving alternative to standard 100V devices for use in main inverter control circuits, electric motors, and electric water pumps.

Transitioning to Automotive 48V Power Architectures
In the automotive sector, escalating electrical demands in high-end vehicle models are driving a transition from conventional 12V networks to 48V power supply systems. This architectural shift, anticipated to see widespread implementation by the end of the decade, necessitates semiconductor components that optimize energy efficiency. By utilizing 80V power MOSFETs within the automotive data ecosystem, engineers can achieve lower power losses than those typically found in standard 100V devices, thereby improving the overall efficiency of vehicle power delivery.

Downsizing and PCB Reliability Mechanisms
The newly released hardware enables significant board space reduction when compared to standard automotive MOSFET packages such as the TO-252, which measures 6.6 by 10.0 millimeters. The new AG160FNS4FRA utilizes the HPLF5060 package measuring 4.9 by 6.0 millimeters, while the AG166FNH7FRA utilizes the DFN3333 package at just 3.3 by 3.3 millimeters.

To maintain structural integrity on PCBs (Printed Circuit Boards) under thermal and mechanical stress, the HPLF5060 incorporates Gull-Wing Leads, and the DFN3333 utilizes Wettable Flank Technology. Both packages integrate Copper Clip Junction Technology to maximize heat dissipation, lowering thermal resistance and allowing the devices to securely manage high continuous currents. All configurations are certified to comply with the AEC-Q101 automotive reliability standard.

Production Status and Future Package Development
Mass production of the AG160FNS4FRA and AG166FNH7FRA models began in April 2026, with distribution channels active through suppliers such as DigiKey and Farnell. Engineering efforts are also underway to expand this 80V component lineup with TOLG (TO-Leaded with Gullwing) packaging, which will measure 9.9 by 11.7 millimeters, to support higher power specifications in larger drivetrain applications.

Additional Context
This section details technical specifications and competitive benchmarking not included in the original news release.

In the automotive semiconductor market, 80V trench MOSFETs are rigorously evaluated based on drain-source on-resistance and junction-to-case thermal resistance. Comparable offerings from established tier-one suppliers, such as Infineon’s OptiMOS automotive series or Nexperia’s trench MOSFETs, utilize similar copper clip bonding in standard 5x6 millimeter footprints to minimize parasitic inductance and achieve low on-state resistance. Furthermore, the implementation of wettable flanks in DFN packages has become a standard industry benchmark. This specific package feature guarantees visible solder fillets, allowing automated optical inspection during PCB assembly—a mandatory quality control step for automotive electronics that standard flat-lead packages cannot reliably support.

Edited by Aishwarya Mambet, Induportals Editor, with AI assistance.

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