Samtec’s COM-HPC Interconnect Solutions for AI, Industrial, IoT Applications

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, now offers COM-HPC^® interconnect solutions from Samtec.

Designed to meet the COM-HPC standard recently introduced by the PCI Industrial Computer Manufacturers Group (PICMG^®), Samtec’s COM-HPC products are high-density, high-performance connectivity systems for emerging technologies such as artificial intelligence (AI), machine vision, embedded edge computing, cybersecurity, 5G infrastructure and connected vehicles, industrial automation, Internet of Things (IoT), and more.

Samtec COM-HPC interconnect solutions, available from Mouser, are based on Samtec’s AcceleRate^® HP high-performance arrays, providing design engineers the scalability and enhanced performance for next-gen embedded system design and interface flexibility. Featuring paired 400-pin connectors (800 pins total), COM-HPC systems offer 32 Gbps per channel, 2088 Gbps per square inch, and 4096 Gbps max aggregate up to 300 W (from 11.4 V – 12.6 V), while supporting existing and future interfaces like PCIe 5.0 (32 GT/s) and 100 Gb Ethernet.

Ideal for server and client modules, medical, datacom, telecom, IoT, or other high-speed, high-cycle applications, the COM-HPC interconnect solutions are available in both 5 mm and 10 mm stack heights and 0.635 mm pitch.

To learn more about the COM-HP interconnect solutions from Samtec, visit https://eu.mouser.com/new/samtec/samtec-com-hpc-interconnect-solutions/.

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