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Infineon's AIROC CYW20829 Bluetooth LE SoC complies with the latest Bluetooth specification 5.4

The AIROC CYW20829 Bluetooth® LE System-on-Chip (SoC) from Infineon Technologies AG complies with the new Bluetooth specification 5.4.

Infineon's AIROC™ CYW20829 Bluetooth LE SoC complies with the latest Bluetooth specification 5.4

With the optimal combination of low power consumption and high performance, AIROC CYW20829 supports the entire spectrum of Bluetooth Low Energy (LE) applications. These include, for example, smart home, sensors, applications in the medical and healthcare sectors, lighting, Bluetooth mesh networks, remote controls, input devices (mouse, keyboard, VR and gaming controllers), industrial automation and automotive.

The recently released Bluetooth Core Specification 5.4 adds several important features to the existing specification, including PAwR (Periodic Advertising with Response), Encrypted Advertisement Data (EAD) and LE GATT security level characteristics. PAwR enables energy-efficient, bi-directional communication in a large-scale one-to-many or star topology. EAD offers a standardized concept for secure data transmission in the form of advertising data packages.

With PAwR, thousands of Bluetooth 5.4-enabled electronic shelf labels (ESL) and sensors can communicate bi-directionally with a single access point. The messages can contain commands, sensor data or other data defined by the application layer. EAD allows the encrypted data over the star network to be authenticated and decrypted only by devices that have previously shared the session key. In addition, the LE GATT security level characteristic allows devices to identify the security mode and security level for all their GATT functions. The combination of these features enables extremely low power consumption, efficient radio use and secure star networks,

"With Infineon's AIROC CYW20829 Bluetooth LE SoC, our customers get excellent radio frequency performance, the latest Bluetooth capabilities, built-in security, a multitude of peripherals and low power consumption in a single device," said Shantanu Bhalerao, Vice President of Bluetooth product line at Infineon. "It allows our customers to take full advantage of Bluetooth 5.4 and get their products to market faster."

Infineon's AIROC CYW20829 offers a best-in-class RF link budget with an integrated power amplifier with 10 dBm transmit power and receive sensitivity of -98 dBm for LE 1 Mbit/s and -106 dBm for LE Long Range 125 kbit/s. The CYW20829 is a dual-core Arm® M33 device, with one M33 core reserved for the Bluetooth controller and the second Arm® Cortex-M33 available for customer applications. The CPU subsystem offers 256K RAM, an XIP interface for external flash memory and a variety of peripherals including CAN to enable a variety of applications. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys, and cryptographic acceleration.

The AIROC CYW20829 is powered by the ModusToolbox™ development environment, which enables developers to accelerate time-to-market of Bluetooth-enabled IoT solutions.

Availability
The AIROC CYW20829 Bluetooth LE SoC is currently shipping to select customers. More information on the AIROC CYW20829 is available here.

www.infineon.com

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