VC AT LASER WORLD OF PHOTONICS: MIPI CAMERAS AND SMART EMBEDDED VISION SYSTEMS

At LASER World of PHOTONICS, which will take place in parallel to the automatica trade fair in Munich, Germany, 27 – 30 June 2023, Vision Components (booth A3-123) will present new MIPI camera modules and embedded vision systems for time-saving, cost-effective development of customized solutions. Highlights include embedded cameras with a MIPI CSI-2 interface, featuring IMX565, IMX566, IMX567 and IMX568 global shutter sensors from the Sony Pregius S series. The camera modules developed and manufactured by Vision Components in Germany combine high image quality and light sensitivity with fast image capture – the perfect fit for a wide range of industrial and commercial applications.

Up to 12 megapixels and global shutters
The VC MIPI IMX565 MIPI camera module with a 12-megapixel sensor offers a maximum resolution of 4096 x 3000 pixels and a frame rate of 42 fps. Also new, the VC MIPI IMX566 is an 8-megapixel camera module with 62 fps, and the VC MIPI IMX567 and VC MIPI IMX568 modules boast 5-megapixel sensors and 96 fps. All VC MIPI^® camera modules are available in monochrome and colour variants.

Designed for industrial series development – even with individually specified sensors
VC MIPI^® modules feature high quality, a ruggedized design and guaranteed long-term availability. The MIPI CSI-2 port allows for easy connection to all common processor platforms. Vision Components provides the corresponding drivers free of charge. The market leader is continuously adding more image sensors to the VC MIPI^® portfolio, also including applications such as SWIR and 3D/ToF. On request, Vision Components also integrates special sensors into MIPI modules, even image sensors with no native MIPI interface.

Smart components: from an FPGA accelerator to modular laser profilers
At LASER World of PHOTONICS, Vision Components will also showcase smart components for faster, easier and more cost-efficient OEM embedded vision development. These include the VC Power SoM FPGA accelerator for complex image processing and easy design-in, modular VC nano 3D-Z laser profilers and the VC picoSmart 3D miniature board camera for the development of ultra-compact and cost-effective OEM 3D triangulation sensors.