New heatsinks from Fischer Elektronik

Increasing functional and connection densities of electronic power semiconductors as well as their constantly increasing packing density generate a certain amount of heat during operation, which is absorbed by the device and dissipated into the environment using suitable heatsink solutions. Heatsinks perfectly adapted to the application for efficient component cooling in the field of electronics are still one of the most frequently used heat dissipation methods. Especially for these applications, Fischer Elektronik GmbH & Co. KG is expanding its extensive product range to include additional high-performance extruded heatsinks made of aluminium.

The new heat sink designs SK 706, SK 707, SK 708 and SK 709 are thermally optimised for free convection in terms of base and fin thickness as well as fin spacing and height. Different heatsink widths of 90, 100, 200 and 250 mm enable use in a wide range of applications. Some designs also have a corrugated fin structure to increase efficiency, which further increases the surface area of the heatsink. Due to the material thickness being used, the customised heatsink base ensures solid component mounting thanks to additional semiconductor mounting threads. The new heatsink models are available from stock in various lengths as standard, whereby any length specified by the customer can also be offered and produced. Further mechanical processing in the form of contours, milling or flat milled surfaces can be implemented using modern and high-precision CNC machining centres according to customer-specific drawing specifications. Surface treatments such as grinding, blasting and anodising in various colours, also with additional printing, round off the range of services offered by Fischer Elektronik.

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