The new heat sink designs SK 706, SK 707, SK 708 and SK 709 are thermally optimised for free convection in terms of base and fin thickness as well as fin spacing and height.

Fischer Elektronik GmbH & Co. KG has expanded its extensive range of thermal conductive materials to include new pasty gel thermal conductive materials.

The demands for efficient heat dissipation of electronic devices on the PCB have not been reduced. The increased complexity of the assemblies, as well as the combination of individual functional modules into one component, lead to an unwelcome and, in the long run, harmful power loss on the PCB, which is directly converted into heat.

The use of insulating bushes is always in demand in many technical applications when, for example, screws, electrically conductive connections or even plug contacts need to be insulated from the outside. Insulating bushes are particularly frequently found in connection with electronic semiconductors, in order to mount them insulatingly on circuit boards or on heatsinks.

The steadily increasing trend towards packaging forms suitable for automatic machines is unbroken. As a result the inquiries and orders for machine-compatible packaging for connectors in "tape & reel" packaging have increased significantly in recent months.

Various electronic devices which belong to one product series but are offered in different case sizes due to the electronic components installed in them, require appropriate cases. For those applications Fischer Elektronik offer their customers universal sheet metal cases with freely selectable dimensions now.

So-called circuit board heatsinks for lock-in transistor retaining springs are very often used for greater power losses of electronic components that are installed on a printed circuit board.

The single-board computer Raspberry PI is available in many different designs now. The market also leaves nothing to be desired when it comes to extensions.

Fischer Elektronik is offering its customers the KSG … plastic cases now. It is a universal, lightweight plastic case with a wall thickness of 3 mm. The plastic cases consist of two half-shells which are joined together without screws by snapping the tongue and groove together.

Electronic devices that are installed directly on the circuit board require an adapted thermal management depending on the device size and the power loss to be dissipated.