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SK hynix Develops UFS 4.1 Solution Based on 321-High NAND
Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.
www.skhynix.com

The development comes amid increasing requirements for high performance and low power of a NAND solution product to ensure a stable operation of on-device AI. The company expects the UFS 4.1 product, optimized for AI workload, to help enhance its memory leadership in the flagship smartphone markets.
With an increase in demand for on-device AI leading to greater importance of the balance between computation capabilities and battery efficiency of a device, the mobile market is now requiring thinness and low power from a mobile device.
The latest product comes with a 7% improvement in power efficiency, compared with the previous generation based on 238-high NAND and a slimmer 0.85mm thickness, down from 1mm before, to fit into a ultra-slim smartphones.
The product also supports data transfer speed of 4300MB/s, the fastest sequential read1 for a fourth-generation of UFS, while providing the best-in-class performance by also improving random read and write speed2, critical for multitasking, by 15% and 40%, respectively. Immediate provision of the required data for on-device AI and faster running speed and the responsivity of an application are expected to enhance user experience.
SK hynix plans to win customer qualification within the year and ship in volume from the first quarter of next year. The product will be provided in two capacity types – 512 GB and 1TB.
www.skhynix.com