18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Rohm Semiconductors News

Ultra-Low IQ PMIC from ROHM Selected to Power NXP iMX8M Nano for High Performance Embedded Artists Industrial Control Board

ROHM Semiconductor today announced that Embedded Artists, the producer of embedded SoMs and boards for use in industrial systems and as development platforms, is using a highly integrated PMIC from ROHM together with NXP’s i.MX 8M Nano processor on its iMX8M Nano uCOM board to deliver a robust and cost-effective solution for industrial applications. ROHM’s BD71847AMWV is a system PMIC for i.MX 8M Nano, as well as 8M Mini.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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MURATA News

World’s smallest LoRaWAN^® modem module reduces current consumption

Murata today announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN^® modem solution.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Infineon News

“We make IoT real” – Infineon showcases its comprehensive portfolio at virtual Embedded Solutions Conference 2021

The acquisition of Cypress positions Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as one of the world's top 10 semiconductor manufacturers.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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TDK News

Open frame buffer modules offer 380ms additional hold-up for 12V, 15V or 24V output power supplies

TDK Corporation (TSE 6762) announces the introduction of the open frame ZBM20 buffer modules with the capability to provide 380ms additional hold-up for 12V, 15V and 24V AC-DC power supplies.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Rutronik News

Immerse yourself in the world of embedded systems: Rutronik TechTalk meets embedded world 2021

Stay digital but connected: Rutronik will be presenting products and solutions for the innovation driven markets of embedded, (I) IoT, Industry 4.0, robotics, measurement, logistics, energy, medicine and biotechnology, automation and artificial intelligence at embedded world DIGITAL and as part of the successfully established TechTalk from 2 to 4 March 2021.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

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Gradconn News

I-PEX^® MHF^® 4L LK and MHF^® 5L options now available for GradConn Cable assemblies

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

ONSEMI News

ON Semiconductor Announce New 650V Silicon Carbide MOSFETs

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

Adlinktech News

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

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18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR Systems strengthens functional safety offering with extended standards coverage

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

TDK News

TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability

Aluminum electrolytic capacitors.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Ultra-Low IQ PMIC from ROHM Selected to Power NXP iMX8M Nano for High Performance Embedded Artists Industrial Control Board

World’s smallest LoRaWAN^® modem module reduces current consumption

Murata today announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN^® modem solution.

“We make IoT real” – Infineon showcases its comprehensive portfolio at virtual Embedded Solutions Conference 2021

The acquisition of Cypress positions Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as one of the world's top 10 semiconductor manufacturers.

Open frame buffer modules offer 380ms additional hold-up for 12V, 15V or 24V output power supplies

TDK Corporation (TSE 6762) announces the introduction of the open frame ZBM20 buffer modules with the capability to provide 380ms additional hold-up for 12V, 15V and 24V AC-DC power supplies.

Immerse yourself in the world of embedded systems: Rutronik TechTalk meets embedded world 2021

I-PEX^® MHF^® 4L LK and MHF^® 5L options now available for GradConn Cable assemblies

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

ON Semiconductor Announce New 650V Silicon Carbide MOSFETs

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

IAR Systems strengthens functional safety offering with extended standards coverage

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability

Aluminum electrolytic capacitors.

International

Market Overview

Technical Articles

Case studies

White Paper

Murata today announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN® modem solution.

The acquisition of Cypress positions Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as one of the world's top 10 semiconductor manufacturers.

TDK Corporation (TSE 6762) announces the introduction of the open frame ZBM20 buffer modules with the capability to provide 380ms additional hold-up for 12V, 15V and 24V AC-DC power supplies.

GradConn expands its range of assemblies featuring MHF® options to include the secure MHF® 4L LK and MHF® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

Market-leading edge AI platforms and GPU computing.

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

Aluminum electrolytic capacitors.

International

Murata today announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN^® modem solution.

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.