CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021.
Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced its next-generation 144-Mb Quad Data Rate II+ (QDR ®-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V).
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new family of ST Intelligent and Integrated Gallium Nitride (GaN) solutions, STi2GaN.
TDK Corporation presents a new series of EPCOS power capacitors for DC link applications. The new capacitors are available for rated voltages of 700 V DC to 2000 V DC and cover a capacitance range of 20 µF to 270 µF.