18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

Gradconn News

I-PEX^® MHF^® 4L LK and MHF^® 5L options now available for GradConn Cable assemblies

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

ONSEMI News

ON Semiconductor Announce New 650V Silicon Carbide MOSFETs

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

Adlinktech News

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR Systems strengthens functional safety offering with extended standards coverage

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

TDK News

TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability

Aluminum electrolytic capacitors.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

Congatec News

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec to solve ruggedization challenges of edge server and client designs.

Read more…

18 {{ "2021-02-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-18T00:00:00+00:00" | date "longDate" }}

Swindonsilicon News

Swindon Silicon Systems at Embedded World 2021

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

Read more…

17 {{ "2021-02-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-17T00:00:00+00:00" | date "longDate" }}

Vaisala News

The Red Planet is in sight – FMI and Vaisala’s scientific measurement instruments onboard Mars rover are ready for action

NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.

Read more…

17 {{ "2021-02-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-17T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Launches New 5G RF Regulatory Test System ME7803NR Solution

Anritsu Corporation is pleased to announce the availability of its new RF Regulatory Test System ME7803NR solution for regulatory compliance testing of 5G communications systems.

Read more…

17 {{ "2021-02-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-17T00:00:00+00:00" | date "longDate" }}

Maxim integrated News

Maxim Integrated Enables OMRON to Extend its NXR-Series IO-Link Product Line with I/O Hub Solutions for Industry 4.0

OMRON expands digital IO capabilities for its NXR-Series by adopting Maxim Integrated’s IO-Link products.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

I-PEX^® MHF^® 4L LK and MHF^® 5L options now available for GradConn Cable assemblies

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

ON Semiconductor Announce New 650V Silicon Carbide MOSFETs

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules

Market-leading edge AI platforms and GPU computing.

IAR Systems strengthens functional safety offering with extended standards coverage

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability

Aluminum electrolytic capacitors.

Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec to solve ruggedization challenges of edge server and client designs.

Swindon Silicon Systems at Embedded World 2021

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

The Red Planet is in sight – FMI and Vaisala’s scientific measurement instruments onboard Mars rover are ready for action

NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.

Anritsu Launches New 5G RF Regulatory Test System ME7803NR Solution

Anritsu Corporation is pleased to announce the availability of its new RF Regulatory Test System ME7803NR solution for regulatory compliance testing of 5G communications systems.

Maxim Integrated Enables OMRON to Extend its NXR-Series IO-Link Product Line with I/O Hub Solutions for Industry 4.0

OMRON expands digital IO capabilities for its NXR-Series by adopting Maxim Integrated’s IO-Link products.

International

Market Overview

Technical Articles

Case studies

White Paper

GradConn expands its range of assemblies featuring MHF® options to include the secure MHF® 4L LK and MHF® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.

Market-leading edge AI platforms and GPU computing.

In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.

Aluminum electrolytic capacitors.

congatec to solve ruggedization challenges of edge server and client designs.

Main Theme - Smart Sensors made smarter using custom ICs and SiPs.

NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.

Anritsu Corporation is pleased to announce the availability of its new RF Regulatory Test System ME7803NR solution for regulatory compliance testing of 5G communications systems.

OMRON expands digital IO capabilities for its NXR-Series by adopting Maxim Integrated’s IO-Link products.

International

GradConn expands its range of assemblies featuring MHF^® options to include the secure MHF^® 4L LK and MHF^® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.