04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics Boosts Automotive Innovation with Longevity Extension for Popular Body, Chassis, and Safety Microcontrollers

Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Hitachi News

Hitachi Developed the Hitachi Electronic Signature Service that Promotes to Eliminate Personal Seals with High Authenticity of Information by Blockchain Technology, and Starts Internal Operations

Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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CEA Leti News

CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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Comau News

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Adlinktech News

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Baumer News

Compact machine designs without compromise

Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.

Read more…

03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-03T00:00:00+00:00" | date "longDate" }}

Mouser News

MOUSER ELECTRONICS NEW PRODUCT INSIDER: FEBRUARY 2021

Global Distributor Leads in New Product Introductions.

Read more…

03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-03T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft^® Azure RTOS Projects on STM32 MCUs

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft^®.

Read more…

03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-03T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Unveils Advanced i.MX Applications Processors with Easy-to-Deploy Security, Energy Efficiency and Scalability for the Industrial and IoT Edge

NXP Semiconductors N.V. (NASDAQ: NXPI) today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors.

Read more…

Case studies

Low-Power Congatec SMARC Modules for Powerful AI Inference

STMicroelectronics Boosts Automotive Innovation with Longevity Extension for Popular Body, Chassis, and Safety Microcontrollers

Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.

Hitachi Developed the Hitachi Electronic Signature Service that Promotes to Eliminate Personal Seals with High Authenticity of Information by Blockchain Technology, and Starts Internal Operations

Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.

CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

Compact machine designs without compromise

Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.

MOUSER ELECTRONICS NEW PRODUCT INSIDER: FEBRUARY 2021

Global Distributor Leads in New Product Introductions.

STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft^® Azure RTOS Projects on STM32 MCUs

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft^®.

NXP Unveils Advanced i.MX Applications Processors with Easy-to-Deploy Security, Energy Efficiency and Scalability for the Industrial and IoT Edge

International

Case studies

Availability of SPC56 automotive microcontrollers assured until at least 2034 by extension of longevity program to 20 years.

Go on sale after July as the service that contributes to new workstyle in the New Normal with supporting remote working, operational efficiency and cost reduction.

CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.

Global Distributor Leads in New Product Introductions.

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft®.

International

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft^®.