Instead of meeting in Düsseldorf like every other year, the 2020 medical technology industry meeting will be held virtually. What remains the same is the date: November 16-19, 2020. ebm-papst will be presenting drive technology solutions for the medical sector at virtual.COMPAMED.
Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
dSPACE is setting standards for testing of 4-D radar sensors with a new target simulator. The DARTS 9040-G is the first simulator worldwide to process multiple radar signals simultaneously with a bandwidth of up to 5 GHz. It allows for the reliable and efficient development of cutting-edge, high-resolution radar sensors for driver assistance systems and autonomous driving.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces its redesigned Technical Resource Centre, which contains the global distributor’s ever-expanding collection of technical articles, blogs, eBooks, and Methods technology and solutions journal, plus related product information, in a searchable repository.
PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the CC3230S/CC3230SF SimpleLink Wi-Fi® wireless microcontrollers (MCUs) from Texas Instruments.
STMicroelectronics is pioneering the HMI of things with a new STM32* Nucleo display shield that leverages the affordability of STM32G0 microcontrollers (MCUs). The new X-NUCLEO- GFX01M1 SPI shield is supported in the latest TouchGFX software, version 4.15.0, which introduces additional new features including support for low-cost non-memory-mapped SPI Flash ICs.
MAX25430 slashes design size up to 40 percent and eliminates microcontrollers, metal enclosures and heat sinks for 25 percent lower cost than competitive solutions.