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MURATA News

Murata’s Bluetooth® module with VitaNet Suite enables cloud-centric IoT device

Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.

Rutronik News

More than lighting: Rutronik shows innovative approaches with UV LEDs

For industry, medicine and public infrastructure: The use of UV LEDs offers new approaches in the fields of sterilization, deep cleaning of air and water, agriculture and industrial manufacturing.

Binder News

Rugged circular connectors handle harsh conditions

binder, one of the industry and technology leaders in the field of industrial circular connectors, has expanded its Harsh Environment Connector (HEC) series 696 with some important models. The previous product range is supplemented by flange and cable variants with built-in protective conduit adaptation.

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