18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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E-Peas News

E-PEAS Introduces Versatile New Buck-Boost ICs for Highly Efficient Energy Harvesting from Solar & RF/Vibrational Sources

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

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Dxomark News

Improving Image Stabilization with Hexapod 6-Axis Motion Simulators for More Reliable Image Capturing for Industry, Research and Consumers

Taking sharp pictures despite fast changing lighting and ambient conditions, taking snapshots without blurring, recognizing traffic signs or road markings in driver assistance systems, or identifying dangerous situations in surveillance systems – all of this is possible today with the help of modern cameras. But how are the different criteria for still and video images of cameras reliably measured and evaluated? When testing the image stabilization technologies, for example, hexapods are used to simulate the movement the cameras are subjected to while taking pictures.

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17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

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Telit News

Telit and VAIO Strengthen Strategic Alliance with the Launch of the New VAIO Z Carbon Fiber Notebook Built for 5G

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight’s Open RAN Test Solutions Selected by Auden to Validate Open Radio Access Network Solutions

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

HELLA News

HELLA STRENGTHENS POSITION IN RADAR TECHNOLOGY THROUGH COOPERATION WITH SWEDISH TECH COMPANY FOR WAVEGUIDE ANTENNAS

The internationally positioned automotive supplier HELLA is further expanding its role as one of the world's leading suppliers of radar technology for automated driving functions.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Unveils Infrastructure Processing Unit

Intel’s IPU improves data center efficiency and manageability and is the only one built in collaboration with hyperscale cloud partners.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

MURATA News

Silicon capacitor from Murata boosts technology to support the highest performance requirements of new power distribution networks

Murata has extended its product offering for the mobile and high-performance computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm².

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’s Industry-first AC/DC Converter ICs of Surface Mount Package with Built-In 1700V SiC MOSFET

Improving reliability and energy savings while reducing both mounting area and costs.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight’s New Network Benchmarking Solution Enables Mobile Operators to Verify Quality of Experience Across Multiple 4G and 5G Networks

Scalable solution delivers a complete set of measurements via a single drive test.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Anritsu News

InterDigital and Anritsu Showcase Smart Factory Use Case for 5G Network Slicing and Multi-Access Edge Computing

Anritsu Corporation is pleased to announce a collaborative demonstration with InterDigital, Inc. (NASDAQ:IDCC), a mobile and video technology research and development company, that showcases a smart factory use case for 5G New Radio (NR) using network slicing and multi-access edge computing (MEC) capabilities.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

E-PEAS Introduces Versatile New Buck-Boost ICs for Highly Efficient Energy Harvesting from Solar & RF/Vibrational Sources

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

Improving Image Stabilization with Hexapod 6-Axis Motion Simulators for More Reliable Image Capturing for Industry, Research and Consumers

Telit and VAIO Strengthen Strategic Alliance with the Launch of the New VAIO Z Carbon Fiber Notebook Built for 5G

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Keysight’s Open RAN Test Solutions Selected by Auden to Validate Open Radio Access Network Solutions

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

HELLA STRENGTHENS POSITION IN RADAR TECHNOLOGY THROUGH COOPERATION WITH SWEDISH TECH COMPANY FOR WAVEGUIDE ANTENNAS

The internationally positioned automotive supplier HELLA is further expanding its role as one of the world's leading suppliers of radar technology for automated driving functions.

Intel Unveils Infrastructure Processing Unit

Intel’s IPU improves data center efficiency and manageability and is the only one built in collaboration with hyperscale cloud partners.

Silicon capacitor from Murata boosts technology to support the highest performance requirements of new power distribution networks

Murata has extended its product offering for the mobile and high-performance computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm².

ROHM’s Industry-first AC/DC Converter ICs of Surface Mount Package with Built-In 1700V SiC MOSFET

Improving reliability and energy savings while reducing both mounting area and costs.

Keysight’s New Network Benchmarking Solution Enables Mobile Operators to Verify Quality of Experience Across Multiple 4G and 5G Networks

Scalable solution delivers a complete set of measurements via a single drive test.

InterDigital and Anritsu Showcase Smart Factory Use Case for 5G Network Slicing and Multi-Access Edge Computing

International

Technical Articles

Case studies

White Paper

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

World’s first* 3D-molded, full-carbon chassis VAIO® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

The internationally positioned automotive supplier HELLA is further expanding its role as one of the world's leading suppliers of radar technology for automated driving functions.

Intel’s IPU improves data center efficiency and manageability and is the only one built in collaboration with hyperscale cloud partners.

Murata has extended its product offering for the mobile and high-performance computing (HPC) markets with the availability of its latest silicon process technology to fabricate silicon capacitors with a density of 1.3 µF/mm².

Improving reliability and energy savings while reducing both mounting area and costs.

Scalable solution delivers a complete set of measurements via a single drive test.

International

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.