The latest embedded devices for real-time, high-performance control of industrial automation applications with CC-Link IE TSN have been released by CLPA partner NXP Semiconductors.
CEA-Leti has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization.
SIGA (Electronics) Ltd, the UK’s leading manufacturer of toroidal and bobbin wound components and associated assemblies today announced that its current transformer (CT) products conform to IEC regulations from design, through manufacturing to final test.
Multi-chip architecture points way to continued increases in performance of Toshiba’s optimization computer. Potential to create a game-changing shift in complex financial transactions and robotics.
STMicroelectronics has extended its STM32WB* Bluetooth® LE microcontroller (MCU) offering with new devices that combine entry-level features with extra power savings for longer-lasting performance.
CUI Inc, a Bel group company, today announced the addition of three new lines to its VGS family of chassis mount, single-output ac-dc power supplies housed in a compact metal case.
This innovation (Tiny button) is designed to lock and unlock a car in combination with PKE (Passive keyless Entry System)/ PEPS (Passive Entry/Passive Start) for secure access to vehicles.
High-volume inspection of smartphone camera lenses simplified with low-force probing and optical scanning capabilities in one coordinate measuring machine (CMM).