08 {{ "2020-10-08T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-08T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS extends Ensenso N 3D camera series

New design and improved electronics: Ensenso N40/N45 3D cameras are compact, lightweight and collaborative.

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07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Maxon Motor News

MAXON DEVELOPS ULTRA-EFFICIENT UAV DRIVE WITH STARTUP FLYBOTIX

Maxon has collaborated with drone startup Flybotix to develop performance-optimized brushless DC motors for a new kind of inspection drone.

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07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

ONSEMI news

ON Semiconductor Introduces High-Performance CMOS Global Shutter Image Sensor for Machine Vision and Mixed Reality Applications

The high dynamic range and innovative pixel design of the AR0234CS deliver superior image clarity at 120 fps.

Read more…

07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Maxim integrated News

Maxim Integrated’s Neural Network Accelerator Chip Enables IoT Artificial Intelligence in Battery-Powered Devices

MAX78000 reduces energy consumption and latency by a factor of over 100 to enable complex embedded inference decisions at the IoT edge.

Read more…

07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Mouser News

STMicroelectronics' STWIN SensorTile Wireless Industrial Node for IIoT Now at Mouser

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the STWIN SensorTile wireless industrial node from STMicroelectronics (ST).

Read more…

07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

TDK News

TDK releases new stray-field robust 3D HAL^® position sensor with SPC interface

TDK Corporation (TSE:6762) announces the portfolio expansion of the Micronas masterHAL^® sensor family with the release of HAL 3970, a new stray-field robust 3D HAL^® position sensor.

Read more…

07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment.

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07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Sigmatek News

ModularWide Panels go the Distance with HMI-Link

The ModularWide panel series from SIGMATEK now also provides remote solutions up to 100 m with an HMI-Link unit.

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07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

Tsubaki Kabelschlepp News

NEW CABLE CARRIER UNIFLEX ADVANCED 1775

Our successful cable carrier in new size – more height, more width – simply more space for medium and large cable packages.

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07 {{ "2020-10-07T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-10-07T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics Raises Performance and Value for Smart, Connected Devices with Even Faster STM32H7 Microcontrollers

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed record-breaking STM32* microcontrollers (MCUs) with embedded Flash that bring high-end features such as rich graphics, AI, and state-of-the-art cyber-protection to cost-sensitive new products.

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Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

IDS extends Ensenso N 3D camera series

New design and improved electronics: Ensenso N40/N45 3D cameras are compact, lightweight and collaborative.

MAXON DEVELOPS ULTRA-EFFICIENT UAV DRIVE WITH STARTUP FLYBOTIX

Maxon has collaborated with drone startup Flybotix to develop performance-optimized brushless DC motors for a new kind of inspection drone.

ON Semiconductor Introduces High-Performance CMOS Global Shutter Image Sensor for Machine Vision and Mixed Reality Applications

The high dynamic range and innovative pixel design of the AR0234CS deliver superior image clarity at 120 fps.

Maxim Integrated’s Neural Network Accelerator Chip Enables IoT Artificial Intelligence in Battery-Powered Devices

MAX78000 reduces energy consumption and latency by a factor of over 100 to enable complex embedded inference decisions at the IoT edge.

STMicroelectronics' STWIN SensorTile Wireless Industrial Node for IIoT Now at Mouser

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the STWIN SensorTile wireless industrial node from STMicroelectronics (ST).

TDK releases new stray-field robust 3D HAL^® position sensor with SPC interface

TDK Corporation (TSE:6762) announces the portfolio expansion of the Micronas masterHAL^® sensor family with the release of HAL 3970, a new stray-field robust 3D HAL^® position sensor.

Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment.

ModularWide Panels go the Distance with HMI-Link

The ModularWide panel series from SIGMATEK now also provides remote solutions up to 100 m with an HMI-Link unit.

NEW CABLE CARRIER UNIFLEX ADVANCED 1775

Our successful cable carrier in new size – more height, more width – simply more space for medium and large cable packages.

STMicroelectronics Raises Performance and Value for Smart, Connected Devices with Even Faster STM32H7 Microcontrollers

International

Market Overview

Technical Articles

New design and improved electronics: Ensenso N40/N45 3D cameras are compact, lightweight and collaborative.

Maxon has collaborated with drone startup Flybotix to develop performance-optimized brushless DC motors for a new kind of inspection drone.

The high dynamic range and innovative pixel design of the AR0234CS deliver superior image clarity at 120 fps.

MAX78000 reduces energy consumption and latency by a factor of over 100 to enable complex embedded inference decisions at the IoT edge.

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the STWIN SensorTile wireless industrial node from STMicroelectronics (ST).

TDK Corporation (TSE:6762) announces the portfolio expansion of the Micronas masterHAL® sensor family with the release of HAL 3970, a new stray-field robust 3D HAL® position sensor.

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment.

The ModularWide panel series from SIGMATEK now also provides remote solutions up to 100 m with an HMI-Link unit.

Our successful cable carrier in new size – more height, more width – simply more space for medium and large cable packages.

International

TDK Corporation (TSE:6762) announces the portfolio expansion of the Micronas masterHAL^® sensor family with the release of HAL 3970, a new stray-field robust 3D HAL^® position sensor.