06
'20
Written on
TDK News
05
'20
Written on
TEKTRONIX News
TEKTRONIX ENHANCES ENTRY SOLUTIONS PORTFOLIO WITH EXPANDED TBS1000C DIGITAL STORAGE OSCILLOSCOPE
The new TBS1000C series is designed to meet the needs of today's educational institutions, embedded design engineers and maker community.
05
'20
Written on
HARTING News
HARTING Launches T1 Industrial – the Mating Face for Single Pair Ethernet
HARTING Launches T1 Industrial – the Mating Face for Single Pair Ethernet.
05
'20
Written on
Renesas News
Renesas Introduces Bluetooth Low Energy Module for Ultra-Low Power IoT Applications
New RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards.
05
'20
Written on
Fraunhofer News
Certainty in just 15 minutes – researchers develop a graphene oxide-based rapid test to detect infections
Researchers at the Fraunhofer Institute for Reliability and Microintegration IZM have joined forces with partners in industry and healthcare to develop a handy graphene oxide-based sensor platform to detect acute infections such as sepsis or the antibodies against the coronavirus within minutes.
05
'20
Written on
Vision Components News
MIPI camera and driver for NVIDIA developer kit
Vision Components has added a new starter pack to its MIPI product range for embedded vision projects: users simply connect the camera module and MIPI cable to their NVIDIA Jetson Nano Developer Kit, and they are ready set to start application development.
04
'20
Written on
Provertha News
Straight D-Sub connectors in reliable pressfit technology from PROVERTHA
TMC D-Sub Pressfit 180° series with 9 to 37 pins for high demands.
04
'20
Written on
Ngk insulators News
Chip-type Ceramic Secondary Battery “EnerCera” Series of New Power Sources for IoT Devices Exhibiting a Power Source Module Jointly with TOREX SEMICONDUCTOR LTD. in CES 2020
NGK INSULATORS, LTD. (hereinafter "NGK") based in Nagoya, Japan, announced that it will exhibit a maintenance-free small power source module for IoT devices at CES 2020 jointly with TOREX SEMICONDUCTOR LTD. (President: Koji Shibamiya, Headquarters: Chuo-ku, Tokyo; hereinafter “TOREX”).
04
'20
Written on
Silicon Labs News
Maggy Chooses Silicon Labs Bluetooth SiP for Wearable Social Distancing Device to Fight COVID-19
Identity-Blind Device Protects User Privacy and Delivers High-Performance Accuracy.
04
'20
Written on
Renesas News
