11
'20
Written on
ONSEMI News
11
'20
Written on
ST News
STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile, Connected PC, IoT, and Wearable Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications is extending its leadership in sensor technologies by developing innovative software solutions using technology from Qualcomm Technologies, Inc. through the Qualcomm® Platform Solutions Ecosystem program.
11
'20
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meet IQM News
EUROPE IS ON ITS WAY TO QUANTUM LEADERSHIP IQM RAISES €39 M IN SERIES A FUNDING
IQM Quantum Computers (IQM) the European leader in building superconducting quantum computers, today announced that it has raised €39 M in Series A funding, bringing the total amount of funding raised to date to €71 M.
10
'20
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FLIR Systems Trading Belgium BVBA
FLIR Systems Announces Artificial Intelligence Traffic Cameras for Predictive Traffic Management
New FLIR ThermiCam AI and TrafiCam AI with Artificial Intelligence at the Edge Optimizes Traffic Flow for Improved Roadway Efficiency and Safety
10
'20
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Eckerle News
EE400 NEO - with capacitive sensor technique
The new EE400 NEO is available now, which uses capacitive sensors instead of mechanically operating float switches.
10
'20
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ESCHA News
New Cable Qualities for Data Transmission
The German connectivity specialist ESCHA is well-known for a fast and flexible implementation of current customer requirements to its standard portfolio.
10
'20
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Infineon News
Brand protection is buyer protection: SECORA Blockchain makes the origin and history of a product visible
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a customized security solution for blockchain applications that improves brand and consumer protection.
10
'20
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TEKTRONIX News
Tektronix announces TekScope PC Software with enhanced Multi-Scope Analysis
New software enables engineers to remotely view and analyze 32-channel data from multiple scopes at once.
10
'20
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Cadence News
L&T Technology Services Reduces Mobile and Communications Systems Design Cycle Time by Nearly 40 Percent with Cadence Clarity 3D Solver
Precise accuracy and higher throughput for 3D analysis of complex high-speed interconnects enables more robust designs.
10
'20
Written on
Intelliconnect News
