25 {{ "2022-11-25T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Flying Capacitors in PV Booster stages

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.

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17 {{ "2022-11-17T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Wire Bondable NTC temperature sensor

The NTCWS series can be mounted by wire bonding, achieving small size, high accuracy and unquestionable reliability.

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31 {{ "2022-10-31T00:00:00+00:00" | date "MMM" }} '22

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TDK News

TDK: Power Inductor SPM Series

The SPM series power inductors are the metal composite type wire-wound inductors that have the coils integrally molded with metallic magnetic powder. Compared to ferrite-base wire-wound inductors, the SPM series inductors realize larger current, lower Rdc, smaller size and superior DC bias characteristic.

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28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New SerDes ICs for Automotive Multi-Displays Simplify Video Transmission

The full HD compatible products contribute to functional safety through end-to-end data monitoring.

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26 {{ "2022-10-26T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New Compact 300mA Automotive-Grade LDO Regulators for High Performance ADAS Sensors

ROHM developed automotive-grade LDO regulator ICs: the BUxxJA3DG-C series (BU12JA3DG-C, BU15JA3DG-C, BU18JA3DG-C, BU25JA3DG-C, BU30JA3DG-C, BU33JA3DG-C). The devices are designed for automotive applications such as sensors for ADAS (Advanced Driver Assistance Systems) which have become smaller and more powerful.

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25 {{ "2022-10-25T00:00:00+00:00" | date "MMM" }} '22

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TDK News

PCB Pattern Design for ESD Countermeasures and ESD Visualization

TDK has a lineup of multilayer chip varistors that protect equipment for malfunction and failure due to ESD (electrostatic discharge), and we have long contributed to solving customer ESD problems.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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TDK News

BCL Series Power Inductors

The power inductor BCL series for automotive is compact inductors with high inductance by using TDK’s proprietary material technology and structural design. The use of metallic magnetic core material allows for higher currents than ferrite-based products and a wider operating temperature range, making them suitable for automotives with very high temperature environment.

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19 {{ "2022-08-19T00:00:00+00:00" | date "MMM" }} '22

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TDK News

Introduction to TDK’s New MP-A28 Wireless Power Pattern Coil

TDK, a world leader in material technologies, manufacturing and electronic components, has recently developed and released a state-of-the-art, Qi compliant planar wireless power coil utilizing a unique copper patterning technology that provides multiple end-user benefits. The Wireless Power Consortium [WPC] has designated this new coil as MP-A28, while the corresponding TDK part number is WCT38466-N0E0SST01.

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13 {{ "2022-07-13T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM’s New 4th Gen Fast Recovery Diodes Deliver Low Loss Performance Together with Ultra-Low Noise Characteristics

RFL/RFS series improves power supply efficiency and reduces noise measures in air conditioners and EV charging stations.

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02 {{ "2022-07-02T00:00:00+00:00" | date "MMM" }} '22

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Rutronik Info

For 48 V power supply: Rutronik offers 100 V MLCC with high capacitance value from Samsung Electro-Mechanics

More and more data volumes require increasing computing power in data centers, which leads to a significant increase in power consumption. One approach to meet this requirements is to switch from 12 V to 48 V systems which request 100 V capacitors.

Read more…

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.

The NTCWS series can be mounted by wire bonding, achieving small size, high accuracy and unquestionable reliability.

The full HD compatible products contribute to functional safety through end-to-end data monitoring.

TDK has a lineup of multilayer chip varistors that protect equipment for malfunction and failure due to ESD (electrostatic discharge), and we have long contributed to solving customer ESD problems.

RFL/RFS series improves power supply efficiency and reduces noise measures in air conditioners and EV charging stations.

More and more data volumes require increasing computing power in data centers, which leads to a significant increase in power consumption. One approach to meet this requirements is to switch from 12 V to 48 V systems which request 100 V capacitors.

International