Join the 155,000+ IMP followers

MURATA News

Murata Is Seeking Partners to begin discussions for a New Transparent and Bendable Conductive Film along with the Application of New Ideas to Open up the IoT Era (Technical Explanation)

Murata Manufacturing is now developing a new material with unprecedented strong points. This new material combines transparency, flexibility, conductivity, and safety. Furthermore, it realizes high workability to be able to easily draw circuit patterns and other elements with diverse methods.

Rohm Semiconductors News

ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.

TDK News

TDK: Flying Capacitors in PV Booster stages

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.

TDK News

TDK: Power Inductor SPM Series

The SPM series power inductors are the metal composite type wire-wound inductors that have the coils integrally molded with metallic magnetic powder. Compared to ferrite-base wire-wound inductors, the SPM series inductors realize larger current, lower Rdc, smaller size and superior DC bias characteristic.

Join the 155,000+ IMP followers