15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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STMicroelectronics News

STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Power Integrations News

Power Integrations Unveils 1250 V and 1700 V PowiGaN for 800 VDC AI Data Centers

The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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Microchip News

Microchip Unveils 3 nm PCIe Gen 6 Switch

PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-14T00:00:00+00:00" | date "longDate" }}

Nvidia News

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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Renesas News

Renesas Enables 800V DC Power Architecture for Next-Generation AI Data Centers

Renesas’ GaN-based converters achieve up to 98% efficiency, supporting scalable 48V–800V DC architectures to meet growing AI data center power demands.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

Read more…

13 {{ "2025-10-13T00:00:00+00:00" | date "MMM" }} '25

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Allied Market Research

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

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13 {{ "2025-10-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-13T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Launches STDRIVEG210/211 Half-Bridge GaN Drivers

Compact 220V-rated devices simplify low-voltage GaN power conversion and motor-drive designs for industrial, telecom, and computing applications.

Read more…

13 {{ "2025-10-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-13T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Stepper 28 Click: 2-Phase Bipolar Driver Up to 2.7A

Compact add-on board powered by Toshiba’s TB67S559FTG BiCD constant-current IC delivers 8.2–44V operation, up to 1/32 microstepping, and plug-and-play mikroBUS support for fast motor-control prototyping.

Read more…

10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-10T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

Power Integrations Unveils 1250 V and 1700 V PowiGaN for 800 VDC AI Data Centers

The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.

Microchip Unveils 3 nm PCIe Gen 6 Switch

PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

Renesas Enables 800V DC Power Architecture for Next-Generation AI Data Centers

Renesas’ GaN-based converters achieve up to 98% efficiency, supporting scalable 48V–800V DC architectures to meet growing AI data center power demands.

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

STMicroelectronics Launches STDRIVEG210/211 Half-Bridge GaN Drivers

Compact 220V-rated devices simplify low-voltage GaN power conversion and motor-drive designs for industrial, telecom, and computing applications.

MIKROE Stepper 28 Click: 2-Phase Bipolar Driver Up to 2.7A

Compact add-on board powered by Toshiba’s TB67S559FTG BiCD constant-current IC delivers 8.2–44V operation, up to 1/32 microstepping, and plug-and-play mikroBUS support for fast motor-control prototyping.

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

International