14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Parker News

Parker launches thin bond-line thermal greases for PCB cooling

Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Electro Rent

Electro Rent at 60: Empowering Engineers to Test What’s Next—Without Limits

Electro Rent, a leading global provider in test equipment and technology solutions, celebrates 60 years of helping engineers, innovators, and procurement teams bring ideas to life with greater speed, flexibility, and confidence.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Melexis News

Leapers Semiconductor adopts Melexis silicon RC snubber to enhance next-generation power modules

Melexis has announced that Leapers Semiconductor is integrating the Melexis MLX91299 silicon-based RC snubber into its next-generation power modules, strengthening performance and reliability for automotive and energy applications.

Read more…

14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Toshiba expands protection Zener diodes

Toshiba's latest additions to its CUZ series offer robust surge and ESD protection up to 75V for data center and industrial power supplies.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Allegro Micro Systems News

Allegro étend sa gamme de gate drivers SiC isolés

Allegro MicroSystems lance le chipset AHV85003/AHV85043 afin de compléter sa famille Power-Thru dédiée aux data centers IA et aux véhicules électriques.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Anritsu News

Anritsu unveils visionary 6G solutions at MWC 2026

Intelligent transformation using AI, cloud, and virtual test technologies toward 6G.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Ransemi News

RANsemi and Radisys expand partnership to advance mission-critical 5G communications

RANsemi Limited and Radisys Corporation have announced an expanded collaboration to deliver secure, resilient, and rapidly deployable 5G systems for tactical and mission-critical communications.

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14 {{ "2026-01-14T00:00:00+00:00" | date "MMM" }} '26

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Leuze

High-Speed and Flexible Code Reading for Industrial Traceability

Leuze expands its portfolio with the DCR 100i series, a compact code reader designed for reliable 1D, 2D and DPM code detection across variable working distances and high process speeds.

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13 {{ "2026-01-13T00:00:00+00:00" | date "MMM" }} '26

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IDS Imaging Development Systems GmbH

IDS sets growth and innovation priorities for 2026

IDS strengthens its market position with double-digit growth targets, an expanded product roadmap in AI, 3D and monitoring cameras, and a new three-year manufacturer’s warranty.

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13 {{ "2026-01-13T00:00:00+00:00" | date "MMM" }} '26

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Nvidia News

Life sciences adopt NVIDIA BioNeMo for AI drug discovery

NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.

Read more…

Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.

Electro Rent, a leading global provider in test equipment and technology solutions, celebrates 60 years of helping engineers, innovators, and procurement teams bring ideas to life with greater speed, flexibility, and confidence.

Melexis has announced that Leapers Semiconductor is integrating the Melexis MLX91299 silicon-based RC snubber into its next-generation power modules, strengthening performance and reliability for automotive and energy applications.

Toshiba's latest additions to its CUZ series offer robust surge and ESD protection up to 75V for data center and industrial power supplies.

Allegro MicroSystems lance le chipset AHV85003/AHV85043 afin de compléter sa famille Power-Thru dédiée aux data centers IA et aux véhicules électriques.

Intelligent transformation using AI, cloud, and virtual test technologies toward 6G.

RANsemi Limited and Radisys Corporation have announced an expanded collaboration to deliver secure, resilient, and rapidly deployable 5G systems for tactical and mission-critical communications.

Leuze expands its portfolio with the DCR 100i series, a compact code reader designed for reliable 1D, 2D and DPM code detection across variable working distances and high process speeds.

IDS strengthens its market position with double-digit growth targets, an expanded product roadmap in AI, 3D and monitoring cameras, and a new three-year manufacturer’s warranty.

NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.

International