12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

MIkroe News

Modular MCU Board Accelerates Embedded Prototyping

MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Samsung News

Multi-Die Design Frameworks for Advanced Semiconductor Systems

Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact photorelays can withstand high temperatures

Toshiba introduces voltage-driven relays for dense PCB layouts and reliable switching in automotive electronics and measurement environments.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Microchip News

Hardware Security Modules for Regulatory Compliance and Lifecycle Management

Microchip Technology has expanded its Trust Platform with the TA101 secure authentication integrated circuits to assist developers in meeting stringent international cybersecurity standards and legislative requirements.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Intel News

High-Performance Desktop Processors with Enhanced Multithreaded Architecture

Intel introduces the Core Ultra 200S Plus series to expand the automotive data ecosystem and high-end computational performance for desktop enthusiasts.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Telit News

5G Gateway Platforms Integrate Localization and Radar

Telit Cinterion and Airfide Networks integrate ultra-wideband positioning and 60 GHz radar sensing with FN990B40-based 5G gateway platforms.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Avalue News

Avalue Technology Inc. Launches EMX-PTLP AI Motherboard

Thin Mini-ITX platform powered by Intel Corporation Core Ultra Series 3 for embedded AI systems.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Renesas News

Cloud Platform Integrates Embedded System Design

Renesas launches Renesas 365, a cloud-based platform integrating device selection, system modeling and embedded development workflows.

Read more…

12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-12T00:00:00+00:00" | date "longDate" }}

Synopsys News

Hardware Verification Platforms Target Complex AI Chips

Synopsys expands its hardware-assisted verification portfolio with new ZeBu and HAPS systems designed for large-scale AI chip validation.

Read more…

11 {{ "2026-03-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-11T00:00:00+00:00" | date "longDate" }}

iBASE News

Industrial ATX Motherboard for Edge and Automation

IBASE Technology introduces an ATX motherboard supporting Intel Core processors to deliver scalable computing for industrial automation, edge computing, and machine vision applications.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Modular MCU Board Accelerates Embedded Prototyping

MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.

Multi-Die Design Frameworks for Advanced Semiconductor Systems

Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.

Compact photorelays can withstand high temperatures

Toshiba introduces voltage-driven relays for dense PCB layouts and reliable switching in automotive electronics and measurement environments.

Hardware Security Modules for Regulatory Compliance and Lifecycle Management

Microchip Technology has expanded its Trust Platform with the TA101 secure authentication integrated circuits to assist developers in meeting stringent international cybersecurity standards and legislative requirements.

High-Performance Desktop Processors with Enhanced Multithreaded Architecture

Intel introduces the Core Ultra 200S Plus series to expand the automotive data ecosystem and high-end computational performance for desktop enthusiasts.

5G Gateway Platforms Integrate Localization and Radar

Telit Cinterion and Airfide Networks integrate ultra-wideband positioning and 60 GHz radar sensing with FN990B40-based 5G gateway platforms.

Avalue Technology Inc. Launches EMX-PTLP AI Motherboard

Thin Mini-ITX platform powered by Intel Corporation Core Ultra Series 3 for embedded AI systems.

Cloud Platform Integrates Embedded System Design

Renesas launches Renesas 365, a cloud-based platform integrating device selection, system modeling and embedded development workflows.

Hardware Verification Platforms Target Complex AI Chips

Synopsys expands its hardware-assisted verification portfolio with new ZeBu and HAPS systems designed for large-scale AI chip validation.

Industrial ATX Motherboard for Edge and Automation

IBASE Technology introduces an ATX motherboard supporting Intel Core processors to deliver scalable computing for industrial automation, edge computing, and machine vision applications.

International