15
'21
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Dunkermotoren News
15
'21
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TDK News
Film capacitors: TDK offers robust X2 capacitors for high-temperature requirements
TDK Corporation (TSE:6762) presents a new series of EPCOS MKP-X2 capacitors for interference suppression.
15
'21
Written on
Rohm Semiconductors News
32bit D/A Converter IC for Hi-Fi Audio Equipment
ROHM's first, most advanced MUS-IC series DAC chip enables expressive playback of classical music.
15
'21
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TDK News
TDK announces worldwide availability of the InvenSense ICP-10125 waterproof SmartPressure platform
TDK Corporation (TSE: 6762) announces worldwide availability of the InvenSense ICP-10125, part of the SmartPressure family of the MEMS barometric pressure sensor platform. The ICP-10125 achieves the industry’s lowest pressure noise of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C.
15
'21
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Axis Communications News
AXIS W100 Body Worn Camera wins Red Dot for high design quality
Axis Communications has been successful in the Red Dot Award: Product Design 2021. The international jury has awarded AXIS W100 Body Worn Camera the distinction “Red Dot”, which stands for high design quality.
15
'21
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Keysight technologies News
Keysight Delivers Multi-gigabit Automotive Ethernet Test Solutions to Ensure Standard Compliance and Enable Faster Time-to-Market
Expands automotive Ethernet software portfolio to address multi-gigabit standards that govern automotive Ethernet for the designers and validation teams of in-vehicle networks.
15
'21
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HARTING News
Faster wall-mounting for connectors
Fully EMC-shielded and highly robust outdoor housings can now be rear-mounted.
15
'21
Written on
ST News
Digital Isolator from STMicroelectronics Boosts Performance and Reliability Using New Thick-Oxide Galvanic Isolation Technology
STMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a new series of high-performance ICs for industrial applications and general optocoupler replacement.
15
'21
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ANSYS News
H3C Semiconductor and Ansys Innovate Next-Generation Network Processor Chip for High-end Routing, 5G Backhaul, AI and Cybersecurity Applications
Ansys’ multiphysics platform enabled H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability.
15
'21
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Yokogawa News
