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Fraunhofer News

Fraunhofer and Leibniz institutes kick off the "Green ICT @ FMD" competence center

In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).

Keysight technologies News

Keysight Technologies, Jiyun Technologies Collaborate to Deliver a Tailored, Compact Battery Test System

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with Jiyun Technologies to develop and deliver a tailored, compact battery test system for electric vehicles (EVs).

CEVA News

CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs

CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN, the industry's first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).

Sivers Semiconductors News

Sivers Semiconductors exhibits together with Richardson RFPD at European Microwave Week 2022

Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will exhibit at the European Microwave Exhibition, 27-29 September, during the European Microwave Week in Milan, Italy, together with its partner Richardson RFPD in booth #C28.

IDS Imaging Development Systems GmbH

IDS presents six different housing variants

IDS adds numerous new USB3 cameras to its product range. Anyone who needs quickly available industrial cameras for image processing projects is not faced with an easy task due to the worldwide chip shortage.

Fraunhofer News

Split manufacturing for trustworthy electronics "Made in Germany"

A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.

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