Parker Chomerics integrates stainless-steel honeycomb structures to provide component protection and optimal thermal regulation for power-dense telecommunications equipment.
From October 21-22 in Berlin, Germany, Xaar presents high-viscosity fluid-deposition architectures for scalable manufacturing of printed and production electronics.
New thermal imaging camera delivers 1280 × 1024 HD resolution in the compact A-Series platform, providing a straightforward upgrade path for existing research and test environments.
Infineon Technologies AG and ZuriQ AG are combining semiconductor manufacturing processes with micro-trap architectures to produce hardware for commercial quantum systems.
RECOM expands its AC/DC portfolio with a high-power module integrating communication protocols and parallel operation to support demanding industrial networks.
Keysight, University of Glasgow, NPL, and MPI Corporation have demonstrated a continuous 250 GHz on-wafer measurement methodology for sub-terahertz semiconductor research.