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NXP News

NXP presents the FRDM i.MX 91 Development Board

Built around the i.MX 91 applications processor, this board is designed to accelerate industrial and IoT development, offering a cost-effective, secure and connectivity-rich platform.

Texas Instruments News

TI presents new power management chips for modern data centers

The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.

Omron Components News

Omron's new high-temperature relay permits denser board designs

The G3VM S-VSON(L) MOS FET relay is capable of operating at ambient temperatures of up to 125˚C, improving on previous iterations which were limited to ambient temperatures of 110˚C.

Kontron News

JUMPtec expands its strategic solution portfolio with Texas Instruments processors

JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.

Micron News

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

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