08 {{ "2025-01-08T00:00:00+00:00" | date "MMM" }} '25

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Nexperia News

Nexperia enhances Energy Harvesting portfolio with innovative PMIC reducing BOM cost

Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. Complete power management solution enables inductor-less designs.

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07 {{ "2025-01-07T00:00:00+00:00" | date "MMM" }} '25

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AMD News

AMD Announces First Dell Commercial PCs Powered by AMD Ryzen AI PRO Processors

The AMD Ryzen AI PRO processors will enhance AI-driven productivity, security, efficiency, and enterprise performance with innovative silicon, Copilot+ features, and advanced IT manageability.

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07 {{ "2025-01-07T00:00:00+00:00" | date "MMM" }} '25

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Telit News

Telit Cinterion ME310M1-W1 IoT Module Unlocks Global Deployment Opportunities

Featuring Sony’s Altair ALT1350 chipset, the Telit Cinterion ME310M1-W1 is certified by two major U.S. MNOs, opening new possibilities for LTE-M IoT deployments.

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06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

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Nexcom News

Nexcom's new XPPC xx-10N97 balances power & performance for logistics & self-service applications

The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.

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06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon and Flex showcase zone controller design platform for software-defined vehicles

Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.

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06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

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NeuroBlade News

NeuroBlade Empowers Accelerated Next-Gen Data Analytics on New Amazon Elastic Compute Cloud F2 Instances

NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.

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03 {{ "2025-01-03T00:00:00+00:00" | date "MMM" }} '25

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Lane Electronics News

Lane Electronics Presents High-Reliability Connectors at Electronics Live 2025

Lane Electronics is showcasing cutting-edge electronic component technology and solutions for diverse industries at Electronics Live 2025, held at the National Conference Centre, Birmingham, on January 22.

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02 {{ "2025-01-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-02T00:00:00+00:00" | date "longDate" }}

intelec News

Revolutionizing PCB Manufacturing with AI-Powered Quality Inspection

How Huseyn Gasimov's Automated Visual Inspection Prototype is Transforming Production Processes.

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02 {{ "2025-01-02T00:00:00+00:00" | date "MMM" }} '25

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Mediatek News

MediaTek Unveils Dimensity 8400, the First All Big Core Chip for Premium Smartphones

The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.

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26 {{ "2024-12-26T00:00:00+00:00" | date "MMM" }} '24

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Electro Rent

Electro Rent Appoints New Chief Revenue Officer

Alan Mayer joins test equipment services leader Electro Rent, leveraging a best-in-class go-to-market strategy and customer success background to drive growth.

Read more…

Nexperia is expanding its energy harvesting portfolio with the NEH71x0 power management IC (PMIC) family. Complete power management solution enables inductor-less designs.

The AMD Ryzen AI PRO processors will enhance AI-driven productivity, security, efficiency, and enterprise performance with innovative silicon, Copilot+ features, and advanced IT manageability.

Featuring Sony’s Altair ALT1350 chipset, the Telit Cinterion ME310M1-W1 is certified by two major U.S. MNOs, opening new possibilities for LTE-M IoT deployments.

The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.

Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.

NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.

Lane Electronics is showcasing cutting-edge electronic component technology and solutions for diverse industries at Electronics Live 2025, held at the National Conference Centre, Birmingham, on January 22.

How Huseyn Gasimov's Automated Visual Inspection Prototype is Transforming Production Processes.

The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.

Alan Mayer joins test equipment services leader Electro Rent, leveraging a best-in-class go-to-market strategy and customer success background to drive growth.

International