30
'26
Written on
Toshiba News
30
'26
Written on
Microchip News
Microchip Technology expands its MCU portfolio
These 5V-capable microcontrollers deliver high performance for industrial and consumer applications while maintaining low system complexity and costs.
30
'26
Written on
Tria Technologies News
Compact OSM module targets edge AI platforms
Tria Technologies introduces a 45 mm system-on-module built around NXP’s i.MX 95 for industrial and vision-based edge computing.
30
'26
Written on
Würth Elektronik News
Würth Elektronik at embedded world 2026
From March 10 to 12, in Nuremberg, Germany, Würth Elektronik showcases secure wireless connectivity for embedded systems.
30
'26
Written on
Keysight technologies News
Multi-Terabit Interconnect Validation for AI Data Centers
Keysight Technologies and Point2 Technology collaborate to validate power-efficient interconnects for hyperscale AI infrastructure.
29
'26
Written on
Phytec News
Compact SoM Targets Real-Time Industrial Edge Designs
PHYTEC introduces a 30 mm module based on NXP’s i.MX RT1170 MCU with Zephyr OS support for secure, low-power embedded and IoT applications.
29
'26
Written on
Würth Elektronik News
Halogen-Free Shielding Gaskets for EMC Sealing
Würth Elektronik expands its EMC gasket portfolio with a halogen-free version for industrial and electronics enclosure applications.
29
'26
Written on
Delta Electronics
Delta Partners with MODEC and Eld Energy to Deploy SOFC Systems on FPSOs
Collaboration targets a 120 kW solid oxide fuel cell pilot by 2027, advancing low-carbon power and hydrogen adoption in maritime operations.
29
'26
Written on
NEC Corporation News
High-Efficiency Sub-6GHz Power Amplifier Module
NEC Corporation develops a compact PAM to reduce power consumption and size in 5G radio units.
28
'26
Written on
MIkroe News
