27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Northrop Grumman News

Synthetic diamonds to improve thermal management

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

OMRON News

High-current DC relays for EV and energy storage

Omron introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Danisense News

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Toshiba News

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Renesas News

Bidirectional GaN switch for high-voltage conversion

Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Surface-mount production lines for automotive electronics manufacturing

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Panasonic Industry Introduces High-Precision Thick-Film Resistors

ERJPC series delivers 0.1% tolerance and 25 ppm/K TCR with higher power density, enabling compact and cost-efficient designs for automotive and industrial electronics.

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Synthetic diamonds to improve thermal management

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management.

High-current DC relays for EV and energy storage

Omron introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

Bidirectional GaN switch for high-voltage conversion

Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.

International