These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.
By joining forces with the Chinese circular connectors specialist based in southern China, LAPP aims to expand its global market presence and manufacturing footprint for industrial connectors.
Rutronik presents Toshiba’s TLP3414S and TLP3431S photo relays with faster switching, low resistance, and compact design for high-performance semiconductor test systems.
ROHM supports NVIDIA’s 800V HVDC AI data centers with advanced SiC and GaN power semiconductors, enabling efficient, scalable, and sustainable high-voltage power infrastructure.