Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures.
Kontron introduces new COM Express® modules, COMe-bRP6, COMe-cRP6 and COMe-mRP10, based on 13th Gen Intel® Core. They offer a significant increase in performance compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.
Intelliconnect Ltd, the UK based specialist manufacturer of RF, waterproof and cryogenic connectors is pleased to announce it has been awarded the industry standard Cyber Essentials Certification for the third year in succession across all of their websites.
ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel® W680, Q670, and H610 chipsets.
Rubycon complements the range of extremely compact components with guaranteed high-temperature resistance and long service life. This ranges from 3,000 (MXK), 5,000 (VXK), 7,000 (GXK) and 10,000 hours (NXK) at ambient temperatures up to 105 °C.
Global AI and AIoT are booming, market research agencies predict that there will be as many as 29 billion IoT edge devices in the world by 2030. With such a large volume of edge devices, it is necessary to consider not only remote management, but also how to deploy devices more effectively in order to efficiently implement applications.
The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering.