Anritsu Company and Tektronix cooperate to integrate vector network analysis and oscilloscope-based compliance testing for standardized validation of Automotive Ethernet components.
The certification validates Innodisk’s secure development lifecycle across its full product portfolio, aligning its edge AI and industrial solutions with international cybersecurity and regulatory requirements.
New interdigital electrode chips enable parallel, high-precision material testing, accelerating development of organic electronic devices and sensor technologies.
Silicon Storage Technology and United Microelectronics Corporation qualify SuperFlash Gen 4 eNVM for safety-critical automotive controllers on UMC’s 28HPC+ process.
OMRON Components Europe has introduced ultra-compact G3VM MOSFET relays designed for high-density, high-speed switching in test and measurement equipment.
Northrop Grumman demonstrates compact radiation-testing technology under DARPA program to shorten qualification cycles for space and nuclear microelectronics.
Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.