20 {{ "2026-05-20T00:00:00+00:00" | date "MMM" }} '26

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Swissbit News

PCIe SSD Platform for Embedded Industrial Systems

Swissbit AG introduces a new PCIe Gen4 SSD family for embedded systems, combining low power consumption, industrial endurance, and configurable storage options for mixed and write-intensive workloads.

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20 {{ "2026-05-20T00:00:00+00:00" | date "MMM" }} '26

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Rohm Semiconductors News

ROHM Targets Scalable Automotive SoC Power Design

A configurable automotive power management architecture combining PMIC and DrMOS components is designed to support scalable SoC platforms in ADAS, cockpit, and vision systems.

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20 {{ "2026-05-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-20T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS camera technology powers flexible AI-supported visual inspection system

Modular plug-and-play inspection solution combines AI software, edge computing and IDS uEye XC cameras to enable fast, intuitive visual quality inspection without image processing expertise.

Read more…

20 {{ "2026-05-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-20T00:00:00+00:00" | date "longDate" }}

TDK News

High Efficiency Point Of Load DC To DC Power Modules

TDK Corporation introduces a compact 3A power module designed to support next generation optical transceivers and artificial intelligence edge computing infrastructure.

Read more…

20 {{ "2026-05-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-20T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

High-Density Quasi-Monolithic Chiplet Integration at Wafer Level

Fraunhofer IPMS has developed a quasi-monolithic integration method utilizing structured silicon pockets to embed chiplets for advanced heterogeneous semiconductor manufacturing.

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19 {{ "2026-05-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-19T00:00:00+00:00" | date "longDate" }}

TDK News

Power Electronics Solutions for AI and E-Mobility

TDK Corporation will present new passive components, sensor technologies, and power conversion platforms for industrial systems, electric mobility, renewable energy, and AI data centers at PCIM 2026.

Read more…

19 {{ "2026-05-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-19T00:00:00+00:00" | date "longDate" }}

MIkroe News

Ethernet Interface Board With Dual-Core Processing and Hardware Networking

MIKROE integrates the W55RP20 system-in-package to provide embedded networking and processing capabilities for industrial automation and internet of things gateways.

Read more…

19 {{ "2026-05-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-19T00:00:00+00:00" | date "longDate" }}

Septentrio News

Secure GNSS Positioning for Contested Navigation Environments

Septentrio introduces a compact multi-frequency receiver for autonomous systems requiring resilient positioning, interference awareness, and secure navigation data exchange.

Read more…

19 {{ "2026-05-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-19T00:00:00+00:00" | date "longDate" }}

TDK News

Power Electronics Solutions Target AI and E-Mobility

TDK Corporation presents passive components and sensor technologies for industrial systems, automotive applications and AI data centers at PCIM 2026.

Read more…

18 {{ "2026-05-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-18T00:00:00+00:00" | date "longDate" }}

ScioSense News

Technical Interview on ScioSense UFC23 Front-End Ultrasonic Converter Architecture

Director Norbert Breyer discusses how the ScioSense UFC23 optimizes power and precision for high-resolution industrial water, heat, and gas metering applications.

Read more…

Technical Articles

Redefining Electrical Protection for Data Centers and Critical Infrastructure

Case studies

Wireless test infrastructure expands device certification

White Paper

How to Choose the Right Onboard Charger for Your Battery Pack: 5 Critical Design Considerations

PCIe SSD Platform for Embedded Industrial Systems

Swissbit AG introduces a new PCIe Gen4 SSD family for embedded systems, combining low power consumption, industrial endurance, and configurable storage options for mixed and write-intensive workloads.

ROHM Targets Scalable Automotive SoC Power Design

A configurable automotive power management architecture combining PMIC and DrMOS components is designed to support scalable SoC platforms in ADAS, cockpit, and vision systems.

IDS camera technology powers flexible AI-supported visual inspection system

Modular plug-and-play inspection solution combines AI software, edge computing and IDS uEye XC cameras to enable fast, intuitive visual quality inspection without image processing expertise.

High Efficiency Point Of Load DC To DC Power Modules

TDK Corporation introduces a compact 3A power module designed to support next generation optical transceivers and artificial intelligence edge computing infrastructure.

High-Density Quasi-Monolithic Chiplet Integration at Wafer Level

Fraunhofer IPMS has developed a quasi-monolithic integration method utilizing structured silicon pockets to embed chiplets for advanced heterogeneous semiconductor manufacturing.

Power Electronics Solutions for AI and E-Mobility

TDK Corporation will present new passive components, sensor technologies, and power conversion platforms for industrial systems, electric mobility, renewable energy, and AI data centers at PCIM 2026.

Ethernet Interface Board With Dual-Core Processing and Hardware Networking

MIKROE integrates the W55RP20 system-in-package to provide embedded networking and processing capabilities for industrial automation and internet of things gateways.

Secure GNSS Positioning for Contested Navigation Environments

Septentrio introduces a compact multi-frequency receiver for autonomous systems requiring resilient positioning, interference awareness, and secure navigation data exchange.

Power Electronics Solutions Target AI and E-Mobility

TDK Corporation presents passive components and sensor technologies for industrial systems, automotive applications and AI data centers at PCIM 2026.

Technical Interview on ScioSense UFC23 Front-End Ultrasonic Converter Architecture

Director Norbert Breyer discusses how the ScioSense UFC23 optimizes power and precision for high-resolution industrial water, heat, and gas metering applications.

International