26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

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Danisense News

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

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25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Toshiba News

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Renesas News

Bidirectional GaN switch for high-voltage conversion

Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Anritsu News

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, POSTECH and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

Critical Manufacturing

Critical Manufacturing showcases MES-driven platform at Hannover Messe 2026

Critical Manufacturing demonstrates AI-powered Industrial Operations Platform connecting MES, data and analytics for smarter manufacturing decisions.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

High-Density Isolated Power Modules for Automotive and Data Infrastructure

Texas Instruments introduced isolated power modules using proprietary multichip packaging to increase power density and efficiency in electric vehicle and data center applications.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

Bidirectional GaN switch for high-voltage conversion

Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, POSTECH and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Critical Manufacturing showcases MES-driven platform at Hannover Messe 2026

Critical Manufacturing demonstrates AI-powered Industrial Operations Platform connecting MES, data and analytics for smarter manufacturing decisions.

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

High-Density Isolated Power Modules for Automotive and Data Infrastructure

Texas Instruments introduced isolated power modules using proprietary multichip packaging to increase power density and efficiency in electric vehicle and data center applications.

International