18 {{ "2024-10-18T00:00:00+00:00" | date "MMM" }} '24

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Nexperia News

Nexperia's AC/DC Flyback Controllers Enhance Power Density in GaN-Based Flyback Converters

Nexperia introduces new AC/DC flyback controllers for GaN-based converters, enhancing power efficiency and reducing standby consumption, making them ideal for high-density power applications.

Read more…

18 {{ "2024-10-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-18T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA RELEASES TCKE9 SERIES COMPACT ELECTRONIC FUSES

The reusable eFuse ICs help reduce maintenance costs and recovery time for repairs.

Read more…

18 {{ "2024-10-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-18T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG DEVELOPS INDUSTRY’S FIRST 24GB GDDR7 DRAM FOR NEXT-GENERATION AI COMPUTING

New GDDR7 offers industry-leading capacity and speed of over 40Gbps, significantly raising the bar for graphics DRAM powering future applications.

Read more…

18 {{ "2024-10-18T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT EXPANDS REGENERATIVE POWER SYSTEM SOLUTIONS

Addition of two models for power options of 20kW and 30kW at 500V increases range of applications to enhance high power systems innovation.

Read more…

17 {{ "2024-10-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-17T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Four-Channel Master IC & Sensor Signal Conditioner for the Growing IO-Link Market

The new CCE4511 is the industry’s first four-channel master IC for the IO-Link protocol with 500mA driving current for each channel It saves energy, reduces PCB size & requires fewer external components than competitive offerings.

Read more…

17 {{ "2024-10-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-17T00:00:00+00:00" | date "longDate" }}

Electro Rent

Electro Rent Expands EXFO Test Equipment Agreement to Europe

Giving customers more options to access specialist test & measurement equipment for data centres and RAN/Mobile applications.

Read more…

17 {{ "2024-10-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-17T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Launches the Alveo UL3422 accelerator card, the World's Fastest Electronic Trading Accelerator

The product provides trading firms, market makers & financial institutions with a slim form factor accelerator optimized for rack space, cost & designed for fast path to deployment in servers.

Read more…

17 {{ "2024-10-17T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-17T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

WÜRTH ELEKTRONIK PRESENTS ITS NEW USB SOCKET

Used exclusively for power transmission, it supports the USB Power Delivery (USB-PD) communication protocol for adaptive charging up to 240 W.

Read more…

16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-16T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio

Offering speeds up to 6,400 MT/s, two times faster than DDR4, Micron’s first-ever CUDIMM and CSODIMM memory solutions offer the performance boost needed for AI computing.

Read more…

16 {{ "2024-10-16T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-16T00:00:00+00:00" | date "longDate" }}

Nvidia News

NVIDIA Contributes Blackwell Platform Design to Open Hardware Ecosystem

NVIDIA to share portions of GB200 NVL72 system, including rack architecture, compute & switch tray mechanicals, liquid-cooling and more, to support higher compute density & networking bandwidth.

Read more…

Case studies

How Intel Helps Deliver World-class AI PCs to Top PC Makers

White Paper

ABB STUDY REVEALS ROBOTIC MACHINING BOOSTS ELECTRONICS MANUFACTURING PRODUCTIVITY BY 33%, OFFERS 1200% ROI

Nexperia's AC/DC Flyback Controllers Enhance Power Density in GaN-Based Flyback Converters

Nexperia introduces new AC/DC flyback controllers for GaN-based converters, enhancing power efficiency and reducing standby consumption, making them ideal for high-density power applications.

TOSHIBA RELEASES TCKE9 SERIES COMPACT ELECTRONIC FUSES

The reusable eFuse ICs help reduce maintenance costs and recovery time for repairs.

SAMSUNG DEVELOPS INDUSTRY’S FIRST 24GB GDDR7 DRAM FOR NEXT-GENERATION AI COMPUTING

New GDDR7 offers industry-leading capacity and speed of over 40Gbps, significantly raising the bar for graphics DRAM powering future applications.

KEYSIGHT EXPANDS REGENERATIVE POWER SYSTEM SOLUTIONS

Addition of two models for power options of 20kW and 30kW at 500V increases range of applications to enhance high power systems innovation.

Renesas Introduces Four-Channel Master IC & Sensor Signal Conditioner for the Growing IO-Link Market

The new CCE4511 is the industry’s first four-channel master IC for the IO-Link protocol with 500mA driving current for each channel It saves energy, reduces PCB size & requires fewer external components than competitive offerings.

Electro Rent Expands EXFO Test Equipment Agreement to Europe

Giving customers more options to access specialist test & measurement equipment for data centres and RAN/Mobile applications.

AMD Launches the Alveo UL3422 accelerator card, the World's Fastest Electronic Trading Accelerator

The product provides trading firms, market makers & financial institutions with a slim form factor accelerator optimized for rack space, cost & designed for fast path to deployment in servers.

WÜRTH ELEKTRONIK PRESENTS ITS NEW USB SOCKET

Used exclusively for power transmission, it supports the USB Power Delivery (USB-PD) communication protocol for adaptive charging up to 240 W.

Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio

Offering speeds up to 6,400 MT/s, two times faster than DDR4, Micron’s first-ever CUDIMM and CSODIMM memory solutions offer the performance boost needed for AI computing.

NVIDIA Contributes Blackwell Platform Design to Open Hardware Ecosystem

NVIDIA to share portions of GB200 NVL72 system, including rack architecture, compute & switch tray mechanicals, liquid-cooling and more, to support higher compute density & networking bandwidth.

International