18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

innodisk

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

ZF News

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Danisense News

Danisense Showcases New Current Transducer at APEC

High-precision clamp-on sensor launch highlights advanced current measurement solutions.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Leuze

Leuze – Improving Machine Safety: Practical Limits of Muting and Safer Alternatives

Muting enables uninterrupted material flow in automated systems, but incorrect implementation can create safety gaps that require alternative safety concepts.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

220 GHz Analyzer Extends Optical Transceiver Validation

Keysight introduces a 220 GHz lightwave component analyzer to support high-speed optical transceiver validation for data center and telecommunications applications.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

ST Integrates Robotics Hardware with NVIDIA AI Platforms

The collaboration between the two companies aims to combine sensors, microcontrollers and simulation models in order to streamline the development of robotic systems.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Maximize Your Power System Efficiency

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

Danisense Showcases New Current Transducer at APEC

High-precision clamp-on sensor launch highlights advanced current measurement solutions.

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

Leuze – Improving Machine Safety: Practical Limits of Muting and Safer Alternatives

Muting enables uninterrupted material flow in automated systems, but incorrect implementation can create safety gaps that require alternative safety concepts.

220 GHz Analyzer Extends Optical Transceiver Validation

Keysight introduces a 220 GHz lightwave component analyzer to support high-speed optical transceiver validation for data center and telecommunications applications.

ST Integrates Robotics Hardware with NVIDIA AI Platforms

The collaboration between the two companies aims to combine sensors, microcontrollers and simulation models in order to streamline the development of robotic systems.

International