The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.
Digid qualifies printed electronics technology for volume production of micrometre-scale sensors targeting robotics, medical devices, and advanced biosensing applications.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.
Thales collaborates with Samsung Electronics to supply quantum-resistant cryptographic software for a security chip showcased at the CES 2026 technology exhibition in Las Vegas.
Manufacturers deploy Gigabit Multimedia Serial Link technology to support high-bandwidth, low-latency video and sensor data across automotive and industrial sectors.
SECO introduces a new COM Express Type 6 module based on Intel Core Ultra Series 3 processors, targeting AI-driven industrial and embedded edge systems.
STMicroelectronics expands the STM32MP2 series with the STM32MP21 MPUs, combining low power consumption, flexible performance, and a security architecture aligned with industrial and IoT requirements.
ADLINK Technology Inc. introduces the Express-PTL COM Express module based on Intel Core Ultra Series 3 processors to support demanding edge AI and embedded applications.