25
'26
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Renesas News
25
'26
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Yaskawa News
Multi-protocol board integrates industrial communication and motion control
Yaskawa introduces the TRITON platform, a PCIe multi-protocol board developed in Europe to combine industrial communication, motion control, and PLC functionality within a single hardware architecture.
25
'26
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Infineon News
Infineon presents embedded processing and sensing solutions
Next-generation microcontrollers and sensors target real-time control, connectivity and perception across automotive, industrial automation and edge AI applications.
25
'26
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Kontron News
Compact System-on-Module targets energy-efficient embedded platforms
Kontron Electronics expands its embedded computing portfolio with an OSM-compliant module designed for scalable edge devices, industrial automation, and connected infrastructure applications.
25
'26
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Synaptics News
Synaptics presents edge AI platforms at Embedded World 2026
Integrated processing and connectivity demonstrations explore local inference and wireless performance across IoT, robotics and automotive embedded systems.
25
'26
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Anritsu News
High-Frequency Wireless Device Validation for Next-Generation Cellular Networks
Anritsu Corporation introduces advanced 7 GHz band verification capabilities to support the transition from 5G deployments toward future 6G mobile communication standards.
25
'26
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NXP News
NXP Introduces 10BASE-T1S PMD Transceiver for Edge Ethernet
New automotive and industrial transceivers enable low-cost multi-drop Single Pair Ethernet for software-defined vehicle and industrial architectures.
25
'26
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AMD News
AMD, Meta Sign 6-GW AI Infrastructure Agreement
Multi-year deployment of AMD Instinct GPUs and EPYC CPUs will power rack-scale AI systems beginning in 2026.
25
'26
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Fraunhofer News
Fraunhofer IPMS Partners with TSN Lab
Joint project advances 10Base-T1S IP cores for automotive and industrial Ethernet.
25
'26
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Avalue News
