18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

The differential pressure sensor relies on high resolution

Würth has released a differential pressure sensor designed to provide calibrated measurement data for HVAC, industrial automation, and medical instruments.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Expands Mobile Power

Experience elite performance with the Intel Core Ultra 9 290HX Plus featuring advanced binary optimization, faster die-to-die frequencies, and Wi-Fi 7 for unparalleled mobile gaming.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Microchip News

Mythic Selects Microchip MemBrain Technology for Next Generation Power Efficiency

By integrating SST’s SuperFlash based analog compute-in-memory technology, Mythic aims to deliver ultra-low-power AI inference performance reaching 120 TOPS/watt for edge and data center applications.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

innodisk

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

ZF News

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Danisense News

Danisense Showcases New Current Transducer at APEC

High-precision clamp-on sensor launch highlights advanced current measurement solutions.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Maximize Your Power System Efficiency

The differential pressure sensor relies on high resolution

Würth has released a differential pressure sensor designed to provide calibrated measurement data for HVAC, industrial automation, and medical instruments.

Intel Expands Mobile Power

Experience elite performance with the Intel Core Ultra 9 290HX Plus featuring advanced binary optimization, faster die-to-die frequencies, and Wi-Fi 7 for unparalleled mobile gaming.

Mythic Selects Microchip MemBrain Technology for Next Generation Power Efficiency

By integrating SST’s SuperFlash based analog compute-in-memory technology, Mythic aims to deliver ultra-low-power AI inference performance reaching 120 TOPS/watt for edge and data center applications.

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

Danisense Showcases New Current Transducer at APEC

High-precision clamp-on sensor launch highlights advanced current measurement solutions.

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

International