17 {{ "2024-12-17T00:00:00+00:00" | date "MMM" }} '24

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ART News

Guide to basics of SMD rework from A.R.T. designed to help improve electronics manufacturing

Advanced Rework Technology (A.R.T.) newly published guide provides foundational SMD rework techniques, essential tools, and step-by-step processes to help electronics manufacturers reduce waste, save time, and improve PCB quality.

Read more…

17 {{ "2024-12-17T00:00:00+00:00" | date "MMM" }} '24

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NXP News

NXP and Bitsensing Collaborate on Advanced Radar Systems for Various Key Industries

The collaboration aims to offer high-performance, scalable radar systems across automotive, smart cities, robotics, healthcare, and beyond by combining NXP’s cutting-edge, advanced radar chipsets.

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17 {{ "2024-12-17T00:00:00+00:00" | date "MMM" }} '24

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Diodes Incorporated News

Diodes Incorporated Introduces 65V, 2A Automotive Buck LED Driver with Fault Protection for Advanced Lighting Applications

Diodes Incorporated announces the expansion of its automotive-compliant* LED driver portfolio by introducing the AL8891Q.

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16 {{ "2024-12-16T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon and EVE Energy collaborate to enable the next generation of battery management systems

The two companies aim at enabling comprehensive battery management system solutions for the automotive market.

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16 {{ "2024-12-16T00:00:00+00:00" | date "MMM" }} '24

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MIkroe News

New Click board from MIKROE helps develop and train ML models for vibration analysis

Featuring NXP’s 3-axis low-g accelerometer, ML Vibro Sens Click helps identify machine health.

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13 {{ "2024-12-13T00:00:00+00:00" | date "MMM" }} '24

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STMicroelectronics News

Quobly Forges Strategic Collaboration with STMicroelectronics to Accelerate its Quantum Processor Manufacturing for Large-Scale Quantum Computing Solutions

Collaboration will leverage ST’s 28nm FD-SOI commercial semiconductor volume manufacturing processes to pave the way towards cost-competitive, large-scale quantum computing solutions.

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13 {{ "2024-12-13T00:00:00+00:00" | date "MMM" }} '24

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U Blox News

U-blox launches new GNSS chip for wearables with low power, high accuracy, and small size

The UBX-M10150-CC combines highly efficient performance and upgradable firmware in a chip measuring just 2.39 x 2.39 x 0.55 mm, enabling the creation of more compact and slimmer wearable technologies that are easily updated and last for longer.

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12 {{ "2024-12-12T00:00:00+00:00" | date "MMM" }} '24

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Kontron News

Kontron, CETIN Partnership to Deliver Thousands of Homes Fibre Connectivity

Over 100,000 Czech households to gain faster and more reliable fibre connectivity through advanced broadband solutions, enhancing internet access over the next three years.

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12 {{ "2024-12-12T00:00:00+00:00" | date "MMM" }} '24

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Ovarro News

The green benefits of edge computing in modern infrastructure

Etienne Clauw, Associate Product Line Manager at Ovarro, explores how Remote Telemetry Units (RTUs) can maximise the benefits of edge computing.

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12 {{ "2024-12-12T00:00:00+00:00" | date "MMM" }} '24

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STMicroelectronics News

STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm

WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules accelerate development and boosts flexibility to deliver advanced consumer and industrial IoT solutions.

Read more…

Advanced Rework Technology (A.R.T.) newly published guide provides foundational SMD rework techniques, essential tools, and step-by-step processes to help electronics manufacturers reduce waste, save time, and improve PCB quality.

The collaboration aims to offer high-performance, scalable radar systems across automotive, smart cities, robotics, healthcare, and beyond by combining NXP’s cutting-edge, advanced radar chipsets.

Diodes Incorporated announces the expansion of its automotive-compliant* LED driver portfolio by introducing the AL8891Q.

The two companies aim at enabling comprehensive battery management system solutions for the automotive market.

Featuring NXP’s 3-axis low-g accelerometer, ML Vibro Sens Click helps identify machine health.

Collaboration will leverage ST’s 28nm FD-SOI commercial semiconductor volume manufacturing processes to pave the way towards cost-competitive, large-scale quantum computing solutions.

The UBX-M10150-CC combines highly efficient performance and upgradable firmware in a chip measuring just 2.39 x 2.39 x 0.55 mm, enabling the creation of more compact and slimmer wearable technologies that are easily updated and last for longer.

Over 100,000 Czech households to gain faster and more reliable fibre connectivity through advanced broadband solutions, enhancing internet access over the next three years.

Etienne Clauw, Associate Product Line Manager at Ovarro, explores how Remote Telemetry Units (RTUs) can maximise the benefits of edge computing.

WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules accelerate development and boosts flexibility to deliver advanced consumer and industrial IoT solutions.

International