01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Melexis News

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Low-RDS(on) MOSFETs optimize automotive power efficiency

STMicroelectronics introduces Smart STripFET F8 MOSFETs to reduce conduction losses and improve thermal performance in automotive power distribution and battery management systems.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Toshiba News

Power MOSFETs improve the efficiency of switched-mode power supplies

Toshiba introduces a 40V N-channel MOSFET designed to enhance power density and thermal management within the automotive and industrial power sectors.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Emerson

Emerson Launches New, Easily Configurable Welding Platform

Branson Polaris Ultrasonic Welding Platform delivers a flexible, scalable and future-proof approach to joining a variety of materials in product packaging and other uses.

Read more…

01 {{ "2026-04-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-01T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

Read more…

31 {{ "2026-03-31T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-31T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

Read more…

31 {{ "2026-03-31T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-31T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing

1.2 MP ToF technology delivers stable, high-speed 3D data for industrial environments, even under motion and changing light conditions.

Read more…

30 {{ "2026-03-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-30T00:00:00+00:00" | date "longDate" }}

Fujitsu News

Dual-band infrared sensor for high-resolution thermal monitoring

Fujitsu develops a dual-wavelength infrared imaging sensor to support advanced thermal detection in security, disaster monitoring, and scientific sensing applications.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Code-Free Three-Phase Motor Driver Simplifies BLDC Design

Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.

Expanded Heat Sink Portfolio Targets Thermal Management Optimization

Würth Elektronik introduces modular heat sink families to improve thermal management efficiency in power electronics, embedded systems, and industrial applications.

ROHM expands op amp portfolio for precision electronics

New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.

Low-RDS(on) MOSFETs optimize automotive power efficiency

STMicroelectronics introduces Smart STripFET F8 MOSFETs to reduce conduction losses and improve thermal performance in automotive power distribution and battery management systems.

Power MOSFETs improve the efficiency of switched-mode power supplies

Toshiba introduces a 40V N-channel MOSFET designed to enhance power density and thermal management within the automotive and industrial power sectors.

Emerson Launches New, Easily Configurable Welding Platform

Branson Polaris Ultrasonic Welding Platform delivers a flexible, scalable and future-proof approach to joining a variety of materials in product packaging and other uses.

congatec enables rugged AI computing with Intel Core Ultra COMs

New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.

7–15 GHz Beamforming ICs for FR3 Networks

Sivers Semiconductors introduces Daybreak chipset to support 5G-Advanced and 6G FR3 deployments in base stations and CPE markets.

IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing

1.2 MP ToF technology delivers stable, high-speed 3D data for industrial environments, even under motion and changing light conditions.

Dual-band infrared sensor for high-resolution thermal monitoring

Fujitsu develops a dual-wavelength infrared imaging sensor to support advanced thermal detection in security, disaster monitoring, and scientific sensing applications.

International