05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

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NXP News

Ultra-Wideband Supports Digital Access and Vehicle Presence Detection

BMW Group is deploying NXP Semiconductors’ ultra-wideband technology for secure digital vehicle access and in-cabin presence detection across selected 2026 vehicle programs.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Axial aluminum electrolytic capacitors for heavy DC links

TDK Corporation expands its electrolytic capacitor portfolio for 48-volt to 120-volt systems in order to effectively reduce component counts within industrial traction inverters.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs Launches BG2B Bluetooth SoC Delivering Ultra-Low-Power IoT Performance

New chip combines Bluetooth Channel Sounding, Secure Vault, CAN-FD integration extending battery life while reducing system cost for developers worldwide.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches TXZ+ M4L Microcontroller Series

These Arm Cortex-M4 components integrate hardware accelerators for efficient and secure motor control.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Rision News

RISION Launches Magic Series USB-C Thermal Cameras

The compact, battery-free modules transform smartphones and computers into precision thermal inspection tools across consumer and professional applications.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Demonstrates PCIe Gen 6 Storage Architecture with Micron

Switchtec PCIe Switches and Micron 9650 NVMe solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Kioxia News

CXL Memory Expansion Modules for AI Infrastructure

KIOXIA introduces a high-performance flash-based module designed to bridge the capacity and cost gap between standard DRAM and solid-state storage.

Read more…

05 {{ "2026-08-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-05T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM presents second-generation Terahertz Wave Oscillation Device

To address the growing demand for improved signal quality in application development, ROHM has now developed a second-generation terahertz wave oscillation device.

Read more…

04 {{ "2026-08-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-04T00:00:00+00:00" | date "longDate" }}

Acbel

Acbel Strengthens European EV Presence with Integrated Power Solutions

Acbel showcased integrated onboard power and charging technologies that simplify EV system integration, support 800V architectures, and accelerate next-generation electric mobility across Europe.

Read more…

04 {{ "2026-08-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-04T00:00:00+00:00" | date "longDate" }}

Beckhoff News

Beckhoff Warns on Over-Specifying Automation Systems

Scalable architectures and right-sized components reduce costs without limiting future machine flexibility.

Read more…

Case studies

IDS cameras enable interactive museum experiences with vvvv and SCHNELLE BUNTE BILDER

Ultra-Wideband Supports Digital Access and Vehicle Presence Detection

BMW Group is deploying NXP Semiconductors’ ultra-wideband technology for secure digital vehicle access and in-cabin presence detection across selected 2026 vehicle programs.

Axial aluminum electrolytic capacitors for heavy DC links

TDK Corporation expands its electrolytic capacitor portfolio for 48-volt to 120-volt systems in order to effectively reduce component counts within industrial traction inverters.

Silicon Labs Launches BG2B Bluetooth SoC Delivering Ultra-Low-Power IoT Performance

New chip combines Bluetooth Channel Sounding, Secure Vault, CAN-FD integration extending battery life while reducing system cost for developers worldwide.

Toshiba Launches TXZ+ M4L Microcontroller Series

These Arm Cortex-M4 components integrate hardware accelerators for efficient and secure motor control.

RISION Launches Magic Series USB-C Thermal Cameras

The compact, battery-free modules transform smartphones and computers into precision thermal inspection tools across consumer and professional applications.

Microchip Demonstrates PCIe Gen 6 Storage Architecture with Micron

Switchtec PCIe Switches and Micron 9650 NVMe solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity.

CXL Memory Expansion Modules for AI Infrastructure

KIOXIA introduces a high-performance flash-based module designed to bridge the capacity and cost gap between standard DRAM and solid-state storage.

ROHM presents second-generation Terahertz Wave Oscillation Device

To address the growing demand for improved signal quality in application development, ROHM has now developed a second-generation terahertz wave oscillation device.

Acbel Strengthens European EV Presence with Integrated Power Solutions

Acbel showcased integrated onboard power and charging technologies that simplify EV system integration, support 800V architectures, and accelerate next-generation electric mobility across Europe.

Beckhoff Warns on Over-Specifying Automation Systems

Scalable architectures and right-sized components reduce costs without limiting future machine flexibility.

International