Würth Elektronik presents compact Tarvos e and Olis e radio modules, 12×8×2 mm, CC1310-based, energy-efficient, ideal for proprietary wireless solutions and battery-powered devices.
Schaeffler implements ASMPT SIPLACE SX and Viscom AOI systems, creating connected SMT lines that automatically adapt to alternative components for efficient, flexible electronics production.
The new confocalDT IFC2411 and IFC2416 controllers offer precise, fast distance and thickness measurements up to 25 kHz, high light intensity, and easy industrial integration via modern interfaces.
CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.
The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.
The 80V PSMN1R9-80SSJ and 100V PSMN2R3-100SSJ MOSFETs provide enhanced dynamic current sharing, designed for high-power 48V systems using multiple parallel MOSFETs.
Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.
300mA device delivers ultra-low quiescent current, wide voltage tolerance, and high thermal resilience for body control, telematics, and EV applications.