18
'26
Written on
STMicroelectronics News
17
'26
Written on
Melexis News
Integrated Current Sensors Expand Automotive Power Measurement
Melexis introduces the MLX91224 and MLX91225 isolated current sensor platform, delivering plug-and-play measurement up to 100 ARMS for electric vehicle powertrains, chargers, and industrial power systems.
17
'26
Written on
Harman News
HARMAN Joins SDVerse Marketplace
HARMAN joins the SDVerse B2B marketplace to provide automakers with expanded access to software-defined vehicle products and engineering solutions.
17
'26
Written on
TME News
Global Expansion of Electronic Component Logistics
Transfer Multisort Elektronik Sp. z o.o. presents international growth strategies and automated distribution infrastructure at Electronica 2026.
17
'26
Written on
ONSEMI News
onsemi Introduces Embedded Power Platform for Higher Power Density
Silicon wafer packaging integrates multiple dies and optimizes electrical, thermal and mechanical performance for AI infrastructure, electric vehicles and industrial applications.
17
'26
Written on
Samsung News
Samsung Launches 245.76TB BM1773 SSD for High-Density AI Data Centers
E3.S QLC SSD combines PCIe 5.0, 4.5GB/s sequential writes, 50K IOPS and enhanced durability for demanding AI workloads.
17
'26
Written on
STMicroelectronics News
STMicroelectronics Unveils New Image Sensor for Automotive In-Cabin Monitoring
The 1.1 MP VD56GA sensor lowers system costs for driver and occupant monitoring in high-volume vehicle platforms through enhanced infrared sensitivity.
17
'26
Written on
FESTO News
Configurable Digital I/O Module for Decentralized Automation
Festo introduces the CPX-AP-I-16DIO M12 configurable digital I/O module to optimize decentralized machine architectures and expand connectivity for Mitsubishi PLC environments.
17
'26
Written on
Aetina
Aetina Introduces AIE-KT78/68 for Integrated AI Perception, Decision-Making and Control in Robotics
The new edge AI systems support local multimodal generative AI, LLM, VLM and VLA model execution while connecting high-resolution sensors with motors, joints and actuators through high-bandwidth interfaces and EtherCAT control.
17
'26
Written on
Intel News
