Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.
Exxelia announces the introduction of a new generation of high-voltage reconstituted mica capacitors designed to combine pulse and filtering capabilities within a compact SMD package.
Microchip Technology has engineered the MD-990-0011-B timing module family to provide turnkey synchronization for servers and virtualized radio access networks powered by Intel processors.
New comparator devices support faster shutdown response and low-voltage operation in industrial systems, improving safety across robotics, power electronics, and energy infrastructure.
New embedded vision systems combine onboard processing, high-resolution sensors, and MIPI interfaces for machine vision, edge analytics, and industrial imaging applications.
Avalue Technology demonstrates industrial computing platforms and edge AI systems at SEMICON Southeast Asia to support data-intensive semiconductor and smart factory operations.