28 {{ "2025-05-28T00:00:00+00:00" | date "MMM" }} '25

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STMicroelectronics News

Integrated matching filters for STM32WL33 wireless microcontrollers

The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimize the main radio’s RF performance.

Read more…

27 {{ "2025-05-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-27T00:00:00+00:00" | date "longDate" }}

BASLER News

Basler Revolutionizes TGV Inspection for Semiconductors

Basler's patented vision solution delivers fast, clear, full inspection of Through Glass Vias, addressing challenges in semiconductor panel-level packaging.

Read more…

27 {{ "2025-05-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-27T00:00:00+00:00" | date "longDate" }}

Rutronik News

Nordic Semiconductor's nPM2100 PMIC Redefines Battery Efficiency for Sustainable IoT

Now available through Rutronik, Nordic's nPM2100 delivers 150nA efficiency and 3x battery life extension for disposable battery applications.

Read more…

27 {{ "2025-05-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-27T00:00:00+00:00" | date "longDate" }}

Nokia News

Nokia and Three Sweden Bridge Digital Divide with 5G Fixed Wireless Access

Nokia's FastMile 5G Gateways enable fiber-quality broadband in Sweden's underserved areas through Three's wireless network.

Read more…

26 {{ "2025-05-26T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-26T00:00:00+00:00" | date "longDate" }}

TME

DC power connectors from Amphenol GEC

TME now offers Amphenol GEC’s PowerLok™ power connectors, ideal for EV, hybrid automotive, and renewable energy applications, including energy storage systems.

Read more…

25 {{ "2025-05-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-25T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Introduces New Radeon Graphics Cards and Ryzen Threadripper Processors at COMPUTEX 2025

AMD unveils RDNA 4 GPUs and Threadripper 9000 CPUs at COMPUTEX 2025, delivering next-gen AI, gaming, and workstation performance for pros, gamers, and creators.

Read more…

23 {{ "2025-05-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-23T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon will supply Rivian's R2 Platform with power modules for electric vehicle traction inverters

The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.

Read more…

23 {{ "2025-05-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-23T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Develops UFS 4.1 Solution Based on 321-High NAND

Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Diode Model Based on Measurement Data

Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

TDK News

TDK offers tiny 0201 inductors for high-frequency circuits

Proprietary 0201-size components with high-frequency capabilities, leveraging advanced structuring and sintering tech, offering finely tuned inductors in multi-layered formats, operating from -55°C to +125°C.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

Integrated matching filters for STM32WL33 wireless microcontrollers

The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimize the main radio’s RF performance.

Basler Revolutionizes TGV Inspection for Semiconductors

Basler's patented vision solution delivers fast, clear, full inspection of Through Glass Vias, addressing challenges in semiconductor panel-level packaging.

Nordic Semiconductor's nPM2100 PMIC Redefines Battery Efficiency for Sustainable IoT

Now available through Rutronik, Nordic's nPM2100 delivers 150nA efficiency and 3x battery life extension for disposable battery applications.

Nokia and Three Sweden Bridge Digital Divide with 5G Fixed Wireless Access

Nokia's FastMile 5G Gateways enable fiber-quality broadband in Sweden's underserved areas through Three's wireless network.

DC power connectors from Amphenol GEC

TME now offers Amphenol GEC’s PowerLok™ power connectors, ideal for EV, hybrid automotive, and renewable energy applications, including energy storage systems.

AMD Introduces New Radeon Graphics Cards and Ryzen Threadripper Processors at COMPUTEX 2025

AMD unveils RDNA 4 GPUs and Threadripper 9000 CPUs at COMPUTEX 2025, delivering next-gen AI, gaming, and workstation performance for pros, gamers, and creators.

Infineon will supply Rivian's R2 Platform with power modules for electric vehicle traction inverters

The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.

SK hynix Develops UFS 4.1 Solution Based on 321-High NAND

Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.

Diode Model Based on Measurement Data

Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP.

TDK offers tiny 0201 inductors for high-frequency circuits

Proprietary 0201-size components with high-frequency capabilities, leveraging advanced structuring and sintering tech, offering finely tuned inductors in multi-layered formats, operating from -55°C to +125°C.

International