New polypropylene film capacitors deliver compact high-energy performance and reliable operation in demanding high-temperature, mission-critical industrial applications.
Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.
ROHM will present power conversion technologies at PCIM Europe 2026 for electric mobility, industrial power systems, renewable energy, and AI infrastructure.
The company will present new high-power-density magnetics, EMI filters, and current sensing technologies designed to support AI-driven vehicle architectures, battery management systems, and next-generation xEV platforms.
The unified workflow enables engineers to simulate complete electrical-optical-electrical signal chains, catching cross-domain issues and accelerating design tradeoffs for next-generation AI infrastructure.
Rutronik supplies the Murata Type 2FR module to consolidate processing and simultaneous wireless networking protocols within connected industrial automation environments.
AMD introduced the Ryzen AI Halo platform and Ryzen AI Max PRO 400 Series processors designed for AI workstations and future Agent Computers capable of running agentic artificial intelligence workloads locally on PCs.
Diodes Incorporated introduces a high-sensitivity Hall-effect latch for automotive motor control and position sensing applications operating in electrically harsh environments.