31 {{ "2025-07-31T00:00:00+00:00" | date "MMM" }} '25

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Fischer Elektronik News

New heat conducting material in foil form

Fischer Elektronik is expanding its already extensive product portfolio to include further innovative and technically high-performance heat conducting foils.

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30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

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Micron News

Micron Unveils Portfolio of Industry-First SSDs to Power the AI Revolution

Micron's new G9 NAND data center SSDs feature the world's first PCIe Gen6 SSD (9650), the 122TB 6600 ION increasing density by 67%, and the 7600 SSD for superior PCIe Gen5 performance.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

TDK News

TDK launches wide frequency inductors for automotive power-over-coax

These inductors offer high impedance beyond 1 GHz, reducing footprint by minimizing PoC filter inductors to one component, suitable for -55 °C to +155 °C environments.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Enhances Industrial Efficiency with Gate Driver Photocouplers

The TLP579xH series, a rail-to-rail output device, enables efficient switching with less voltage drop, ideal for low-voltage applications or full-range signal processing.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

Rutronik News

European response to edge AI challenges: Rutronik adds Axelera AI to its portfolio

Axelera AI is offering energy-efficient, scalable edge AI solutions with the Metis platform—an alternative to GPU-based systems.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon debuts CoolSiC 1200 V G2 MOSFETs in Q-DPAK

Top-side-cooled CoolSiC G2 MOSFETs offer 25% lower switching losses, improved thermal performance, and compact design flexibility.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Installs World’s Largest Commercial QCS at AIST’s G-QuAT Center

Keysight's 1,000-Qubit Quantum Control System solution was installed at the National Institute of Advanced Industrial Science and Technology (AIST) in Tsukuba, Japan.

Read more…

30 {{ "2025-07-30T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-30T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

Texas Instruments presents Dynamic Z-Track technology

Predictive battery management technology from TI delivers up to 30% longer run time in battery-powered electronics.

Read more…

29 {{ "2025-07-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-29T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces 64-bit RZ/G3E MPU

MPU Integrates a Quad-Core CPU, an NPU, High-Speed Connectivity and Advanced Graphics to Power Next-Generation HMI Devices with Full HD Display.

Read more…

28 {{ "2025-07-28T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-07-28T00:00:00+00:00" | date "longDate" }}

ARBOR Technology News

ARBOR Technology performs a new module

Arbor’s EmNANO-iX701is a Mini COM Express Type 10 module with Intel Amston Lake, delivering high efficiency for edge computing, industrial automation, and real-time control in a compact design.

Read more…

Case studies

Low-Power Congatec SMARC Modules for Powerful AI Inference

New heat conducting material in foil form

Fischer Elektronik is expanding its already extensive product portfolio to include further innovative and technically high-performance heat conducting foils.

Micron Unveils Portfolio of Industry-First SSDs to Power the AI Revolution

Micron's new G9 NAND data center SSDs feature the world's first PCIe Gen6 SSD (9650), the 122TB 6600 ION increasing density by 67%, and the 7600 SSD for superior PCIe Gen5 performance.

TDK launches wide frequency inductors for automotive power-over-coax

These inductors offer high impedance beyond 1 GHz, reducing footprint by minimizing PoC filter inductors to one component, suitable for -55 °C to +155 °C environments.

Toshiba Enhances Industrial Efficiency with Gate Driver Photocouplers

The TLP579xH series, a rail-to-rail output device, enables efficient switching with less voltage drop, ideal for low-voltage applications or full-range signal processing.

European response to edge AI challenges: Rutronik adds Axelera AI to its portfolio

Axelera AI is offering energy-efficient, scalable edge AI solutions with the Metis platform—an alternative to GPU-based systems.

Infineon debuts CoolSiC 1200 V G2 MOSFETs in Q-DPAK

Top-side-cooled CoolSiC G2 MOSFETs offer 25% lower switching losses, improved thermal performance, and compact design flexibility.

Keysight Installs World’s Largest Commercial QCS at AIST’s G-QuAT Center

Keysight's 1,000-Qubit Quantum Control System solution was installed at the National Institute of Advanced Industrial Science and Technology (AIST) in Tsukuba, Japan.

Texas Instruments presents Dynamic Z-Track technology

Predictive battery management technology from TI delivers up to 30% longer run time in battery-powered electronics.

Renesas Introduces 64-bit RZ/G3E MPU

MPU Integrates a Quad-Core CPU, an NPU, High-Speed Connectivity and Advanced Graphics to Power Next-Generation HMI Devices with Full HD Display.

ARBOR Technology performs a new module

Arbor’s EmNANO-iX701is a Mini COM Express Type 10 module with Intel Amston Lake, delivering high efficiency for edge computing, industrial automation, and real-time control in a compact design.

International