Beckhoff demonstrates how EtherCAT protocol, PC-based control, AI-integrated TwinCAT 3 software, and XPlanar systems transform semiconductor production from wafer fabrication to packaging.
Critical Manufacturing, a leading provider of next-generation Manufacturing Execution Systems (MES) and a subsidiary of ASMPT, today announced a major appointment. Paul Straeten, a digital transformational visionary, is now appointed as Vice President of Life Sciences.
EcoSonic VpCI-125 HP Bags use permanent ESD additives and vapor-phase corrosion inhibitors to safeguard multi-metal electronics, reducing material use and simplifying packaging.
Led by Infineon Technologies, the Mannheim-CeCaS project unites 28 partners to develop a modular, energy-efficient central car server — strengthening Germany’s leadership in autonomous vehicle innovation.
New portfolio of compact, regenerative power supplies and loads helps engineers address complexity, space, and sustainability demands in modern test environments.
Würth Elektronik expands its MagI³C-VDMM family with 1A, 2A, and 3A step-down modules offering up to 96% efficiency and 4 µA quiescent current for battery use.
Featuring a compact 12-slot LXI/USB chassis and expanded Series 125 reed relays, Pickering highlights scalable, space-saving solutions for automated electronic test and verification systems.
Featuring an eight-core MediaTek Genio processor, Linux OS, and CRA-compliant Thistle Security, the production-ready SBC enables OEMs to build powerful AI and IoT devices in months.
Sivers and POET combine DFB laser technology with the Optical Interposer platform to deliver scalable light-engines for next-generation AI datacenter connectivity.