Jointly developed 3-level standard package enhances inverter efficiency, design flexibility and standardization for industrial and renewable applications.
ROHM develops a surface-mount package architecture designed to maximize thermal dissipation and high-voltage insulation in automotive and industrial power conversion systems.
Nexperia introduced high-voltage wide-bandgap semiconductors featuring a surface-mount configuration designed to optimize thermal dissipation in power-dense systems.
From AI-powered vehicles and embodied intelligence to energy storage, 6G and smart wearables, electronica Shanghai highlights the technologies expected to drive innovation, investment and industrial transformation across the global electronics ecosystem in 2026.
MIKROE introduces a new cellular add-on board providing reliable data transmission and low power consumption for utility meters, industrial sensors, and smart infrastructure.
The new CXL 2.0 and 3.x test solution for the MP1900A BERT streamlines high-speed interface design by evaluating signal integrity under stress conditions.
Vision Components develops an integrated hardware solution that streamlines the synchronization of external triggers and lighting within compact optical inspection networks.