07
'20
Written on
Toshiba News
07
'20
Written on
KEMET News
KEMET Releases New Tantalum Polymer Capacitors for Applications Requiring High Capacitance and High Voltage
KEMET (“KEMET” or the “Company”), a subsidiary of Yageo Corporation (“Yageo”) (TAIEX: 2327), a leading global supplier of electronic components, continues to develop and design solutions suited for alternative energy, industrial/lighting, medical, defense and aerospace, and telecommunications applications with the new Tantalum Stack Polymer (TSP) O 7360-43 and the 82uF/75V rated voltage extension in Polymer Hermetically Sealed.
07
'20
Written on
Fraunhofer News
Sensors for early disease symptom detection in European fruit growing
The apple is the Germans’ favorite fruit. Pears rank sixth in annual per capita consumption. Yet apple and pear trees both frequently suffer from diseases: Apple proliferation and pear decline are widespread in European fruit growing.
07
'20
Written on
Anritsu News
Anritsu Introduces Modular 2-port VNA Family that Combines Performance and Cost Efficiencies at Frequencies Up to 43.5 GHz
New ShockLine ME7868A 2-port USB VNAs Deliver Phase Synchronized Measurements Over Wide Distances Up to 100 Meters.
07
'20
Written on
MURATA News
Murata High Output FORTELION Battery Module Equipped with Lithium-Ion Secondary Battery
Murata Manufacturing Co., Ltd. has developed the MH1701, a FORTELION high-output battery module that is ideal for industrial equipment requiring high output such as uninterruptible power supply (UPS) devices and instantaneous voltage drop compensators, and plans to begin mass production in August.
07
'20
Written on
TDK News
TDK announces ultra-high AOP Analog MEMS microphone, ICS-40638
TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.
07
'20
Written on
VIA Tech News
VIA Accelerates Artificial Intelligence and Machine Learning Education for Schools with VIA Pixetto
VIA Technologies, Inc. today announced the launch of the VIA Pixetto vision sensor, an intuitive and engaging platform for teaching Artificial Intelligence and Machine Learning to students aged twelve and above.
06
'20
Written on
TDK News
EMC components: EMC filters for drive applications
TDK Corporation (TSE:6762) has extended its product range of EMC filters for the Japanese market and now offers the new EPCOS three-phase EMC filters series B84743*R712 for drive applications that are available in L1 low-profile type and book type. TDK-Lambda Corporation will start shipping from August 2020.
06
'20
Written on
Littel Fuse News
Smallest Littelfuse PPTCs Protect Portable Devices from Overcurrent, Overtemperature Conditions
Littelfuse, Inc. (NASDAQ: LFUS), a global manufacturer of leading technologies in circuit protection, power control and sensing, today announced a new series of PPTCs designed to help make the next generation of today’s most-used consumer electronics smaller and more reliable.
06
'20
Written on
Renesas News
