Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.
Broadcom and Samsung Electronics collaborate on a new broadband-optimized fixed wireless access reference platform integrating Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G Modem.
Keysight Technologies integrates a complete EOE simulation solution into ADS 2026 for modeling signal paths in AI infrastructures and high-performance computing systems.
The showcase combines AI compute platforms, industrial storage, connectivity, sensing, and software technologies to support scalable and secure AI deployment across enterprise and industrial applications.
From June 7-12, in Boston, the company will showcase automated RF design simulation, environment emulation, and validation technologies to accelerate development across wireless, satellite, and 6G applications.
Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.
Microchip's new 3.3 kV HV-D3 mSiC power modules accelerate solid-state transformer adoption to deliver efficient, direct medium-voltage power for AI hyperscale facilities and heavy industrial applications.
Cyntec, a global leader in power magnetics and current sensing solutions, will showcase next generation automotive-grade modular components for Battery Junction Box (BJB) at The Battery Show Europe 2026 in Stuttgart from 9th to 11th June.
TDK Corporation introduced a single-die Hall-effect position sensor designed to meet automotive safety requirements for electronic braking and steering control systems.