MediaTek introduces Genio Pro, Genio 420 and Genio 360 platforms delivering generative AI acceleration and multimedia support for edge AI and IoT devices.

Demonstrations span 6G interoperability, 5G-Advanced CPE with Wi-Fi 8, automotive connectivity, edge AI devices and high-bandwidth data center interconnects.

MediaTek advances mobile computing with Dimensity 9500s and Dimensity 8500 chipsets for flagship and premium devices.

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

MediaTek and DENSO partner to develop power-efficient AI chips for advanced driver-assistance systems, enhancing safety and performance for next-generation automotive cockpit technologies.

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

MediaTek Dimensity 9500 boosts 32% CPU, 33% GPU, 200MP imaging, 4K AI, and 30% efficiency, powering flagship 5G smartphones.

Compared to the N3E process, N2P offers an 18% performance increase at the same power, a 36% power reduction, and a 1.2x increase in logic density.

Delivers fast edge processing, low power consumption and advanced multimedia features to IoT devices.

The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.