Infineon Technologies AG a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.