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ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.
www.rohm.com

ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.

DOT-247 SiC power module (41.0mm x 31.5mm x 5.0mm)
The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in approximately half the volume.
The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, ROHM has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.

Evaluation boards will also be made available progressively to facilitate evaluation during application design.
Product Lineup

Application Examples
- PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).
- AI servers (eFuse), EV charging stations, etc.
Sales Information
Availability: ROHM construct mass production (September 2025)
Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.
Comprehensive Support
ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.

www.rohm.com
Availability: ROHM construct mass production (September 2025)
Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.
Comprehensive Support
ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.

www.rohm.com