Join the 155,000+ IMP followers

electronics-journal.com

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.

  www.rohm.com
ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density.


ROHM Launches 2-in-1 SiC Molded Module “DOT-247”
DOT-247 SiC power module (41.0mm x 31.5mm x 5.0mm)


The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in approximately half the volume.

The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.

To address this challenge, ROHM has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.


ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Evaluation boards will also be made available progressively to facilitate evaluation during application design. 

Product Lineup

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Application Examples
  • PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles).
  • AI servers (eFuse), EV charging stations, etc.
Sales Information
Availability: ROHM construct mass production (September 2025)

Products compliant with the automotive reliability standard AEC-Q101 are scheduled to begin sample shipments in October 2025.

Comprehensive Support
ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November 2025.


ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

www.rohm.com

  Ask For More Information…

LinkedIn
Pinterest

Join the 155,000+ IMP followers