ROHM and Tata Electronics Form Strategic Partnership

From l-r: Sumihiro Takashima (Executive Officer, Director of Marketing Headquarters at ROHM), Dr. Kazuhide Ino (Member of the Board, Managing Executive Officer, in charge of Power Devices Business at ROHM), Steve Ghanayem (President, US Operations, Head of Global Sales at Tata Electronics)

As India expands domestic semiconductor capacity to reduce dependency on external supply routes, new manufacturing partnerships are emerging to localize assembly, testing, and packaging. In this context, ROHM Co., Ltd. and Tata Electronics announced a strategic partnership to establish semiconductor manufacturing capabilities in India serving both Indian and global markets.

The collaboration’s initial scope focuses on building a manufacturing framework for power semiconductors in India by combining ROHM’s device technologies with Tata Electronics’ backend capabilities in semiconductor assembly and test.

Building a manufacturing pathway for power devices in India
The partnership is designed to link ROHM’s product and device expertise with Tata Electronics’ packaging, assembly, and testing infrastructure. The companies stated that aligning their sales channels and networks is also part of the plan, intended to accelerate market access and expand customer reach in India.

From an industrial supply perspective, this structure supports a more localized production route for power devices, improving availability for customers seeking domestically produced components and reducing exposure to long lead-times in the global semiconductor supply chain.

First production target: automotive-grade MOSFET in TOLL package
As the first step, Tata Electronics will assemble and test ROHM’s India-designed automotive-grade N-channel 100V, 300A silicon MOSFET in a TOLL package. The companies are targeting mass production shipments by 2027.

This device profile—100V and 300A—fits typical demand patterns for automotive and industrial power conversion applications where current handling capability, thermal performance, and packaging reliability are key factors.

Both companies also indicated plans to jointly market the products manufactured through the collaboration, positioning the output for wider adoption in India and export-oriented supply channels.

Packaging development as a next-stage lever
Beyond the initial MOSFET program, ROHM and Tata Electronics plan to explore co-development of high-value packaging technologies. Packaging is increasingly treated as a differentiating capability for power semiconductors due to its influence on electrical resistance, switching behavior, heat dissipation, and reliability performance across automotive duty cycles.

Aligning with India’s domestic manufacturing roadmap
The partnership is framed around the Government of India’s “Make in India” initiative and the stated approach of “Designed in India, Manufactured in India.” The companies described the collaboration as an effort to develop an India-based ecosystem spanning design, development, and manufacturing, supporting higher domestic value addition and a more stable supply base optimized for Indian market requirements.

What the partnership changes for customers
For OEMs and tier suppliers in automotive and industrial electronics, the agreement signals a move toward more localized availability of automotive-grade power semiconductors, with assembly and test capacity anchored in India. For ROHM, it expands packaged product manufacturing options in-country; for Tata Electronics, it extends backend semiconductor services into a structured product manufacturing relationship—both aimed at increasing resilience in regional supply networks.

www.rohm.com