Syntegon Technology, formerly known as Bosch Packaging Technology, is a global leader in processing and packaging solutions for the pharmaceutical, food, and confectionery industries. Headquartered in Waiblingen, Germany, Syntegon offers a comprehensive portfolio of automated technologies for filling, sealing, labeling, and inspection, designed to enhance efficiency, safety, and sustainability in production processes. The company is committed to delivering innovative and customer-centric solutions, with a presence in over 15 countries and a network of service centers worldwide.
New processor options and Ubuntu Pro support target scalable performance, cybersecurity compliance and faster development across industrial and vision applications.
Free STEP models with visualized field of view help engineers select and integrate S-mount optics for board-level cameras in industrial imaging systems.
Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.
Professional image processing for series products: Phytec will showcase components and services for a fast and cost-effective way to market at the Vision Trade Fair (Stuttgart, October 04-06).