Power Electronics Solutions Target AI and E-Mobility

TDK Corporation will showcase component technologies for industrial power systems, electric mobility, AI data centers and electromagnetic compatibility (EMC) testing at PCIM 2026, held from 9–11 June 2026 at NürnbergMesse in Nuremberg, Germany. At booth 350 in hall 9, the company will exhibit passive components, thermal management solutions and power electronics technologies designed to support higher efficiency, increased power density and digital infrastructure demands.

Component technologies support industrial power conversion and energy storage
Among the industrial and green energy exhibits is an inverter power stack developed by Ingenieurbüro Hoffmann using 3 kV-rated ModCap capacitors and 3.3 kV silicon carbide (SiC) MOSFETs. The system targets energy storage systems and heavy-duty vehicle applications.

A separate 2L-B6I inverter reference design integrates MKP DC-link film capacitors from the B25697 series with Infineon 2.3 kV CoolSiC MOSFETs. The configuration is intended for energy storage, wind and solar inverters, DC fast charging infrastructure and solid-state transformers (SSTs).

TDK will also display an EcoG Powerblock dispenser blade for EV charging systems, replacing four discrete high-voltage contactors with a single 4-in-1 HVC module to reduce assembly complexity and simplify maintenance processes.

A 280 kW traction inverter reference design for commercial, construction and agricultural vehicles includes xEVCap components in the DC link, illustrating high-power electric drive applications.

Sensor technologies target electric mobility and thermal management
The exhibition includes temperature and pressure sensors designed for direct integration into fluid circuits, enabling rapid response and stable signal transmission for thermal management applications.

For automotive systems, TDK will demonstrate embedded motor controllers alongside Hall-effect and tunnel magnetoresistance (TMR)-based magnetic sensors supporting rotor position sensing, current measurement and resolver replacement functions.

The newly introduced TMR TAS magnetic sensors provide analog sensing with zero latency and high bandwidth in compact form factors, targeting alternatives to conventional inductive or resolver-based sensing technologies in electric motor systems.

High-power inverter systems expand electric vehicle applications
In collaboration with Infineon and Shin-Etsu Silicones Europe, TDK will exhibit a 300 kW traction inverter demonstrator integrating xEVCap film capacitors and CarXield EMC filtering technologies. The system uses Infineon EconoDUAL 3 power modules and thermal coupling materials supplied by Shin-Etsu.

Another automotive application on display is the 11 kW bidirectional Tiny Power Box 2 on-board charger developed by Silicon Austria Labs. The charger supports both single-phase and three-phase operation and includes an isolated 14 V DC-DC converter.

TDK will also present advanced aluminum nitride multilayer substrates engineered for thermal management. Aluminum nitride offers comparatively high thermal conductivity and thermal expansion characteristics compatible with silicon and SiC semiconductor materials.

AI data center infrastructure drives demand for power conversion technologies
Under the concept "From grid to core," TDK will demonstrate components addressing AI data center power architectures, including power supply units (PSUs), battery energy storage systems (BESS), uninterruptible power supplies (UPSs) and point-of-load conversion.

Visitors can examine Infineon PSU reference designs delivering 8 kW and 12 kW output to AI servers using compact aluminum electrolytic snap-in capacitors. The exhibits reflect increasing requirements for higher power density in AI computing infrastructure.

The company will also display µPOL converters capable of being stacked to deliver up to 200 A for FPGAs, systems-on-chip (SoCs) and application-specific integrated circuits (ASICs), supporting vertical power delivery architectures used in AI systems.

Additional AI infrastructure technologies include MKP DC-link capacitors for modular solid-state transformers and HVC29 high-voltage contactors for 800 V DC distribution environments.

New EMC laboratory expands testing capacity in Germany
TDK reported that construction is nearing completion on a new EMC laboratory in Regensburg, Germany. The accredited facility will cover approximately 1,700 m², including 1,100 m² dedicated to laboratories and measurement stations.

The site will support EMC testing services and include demonstration areas and customer facilities. PCIM attendees can also view EMC absorbers, including pyramidal absorbers, along with sine-wave filters supporting currents up to 720 A and two-line filters for applications up to 1,500 V and 1,600 A.

Edited by Natania Lyngdoh, Induportals editor, assisted by AI.

www.tdk-electronics.tdk.com