electronics-journal.com
25
'22
Written on Modified on
Qualcomm News
Qualcomm Unveils Next Generation Powerline Communication Device to Support Expanding Industry Need for Vehicle to Charging Station Smart-Grid Communications
Next Generation Powerline Communication Device Supports Global Efforts Towards E-Mobility and a Net-Zero Emissions Society.
Highlights:
- Supports advanced bidirectional communication in smart grid applications to help manage and balance energy flow between electric vehicles and the grid
- Qualcomm Technologies is working with virtually all global, leading automakers and their supply base in support of the Combined Charging Systems international standard for charging electric vehicles
- In alignment with Qualcomm Incorporated’s environmental sustainability efforts, this device also has the potential to contribute to substantially reducing greenhouse gas emissions
In continued efforts to support the growing electric vehicle (EV) segment, Qualcomm Technologies, Inc. today announced a next-generation powerline communication (PLC) device, the QCA7006AQ, designed to address the needs for electric vehicle (EV) charging station communications – also known as electric vehicle supply equipment (EVSE) – that use global Combined Charging System (CCS). The PLC device is based on Qualcomm Technologies’ market proven QCA700X family of products, which have been widely adopted in EV on-board charging units and charging stations across the globe. The QCA7006AQ is compliant with the HomePlug Green PHY (HPGP) specification, which is the leading specification for implementing Vehicle-to-Grid (V2G) systems.
Smart-grid integration allows vehicles to seamlessly authenticate on the network through Plug and Charge automated payments for EV charging, coordinating the timing and direction of energy to and from the grid and home. Smart-grid charging applications supported by the CCS standard allows users the flexibility to choose optimal charging times and extract energy from their EVs as needed, supporting the growing need for EV charging while minimizing peak load power generation and distribution requirements.
This is Qualcomm Technologies’ first QCA700X PLC device designed to support an Ethernet digital interface and that is qualified to support an ambient operating temperature range of -40°C to +105°C (AEC-Q100 Automotive Grade 2). As an optional feature, the QCA7006AQ also supports HomePlug Audio Video (HPAV) streaming at PHY rate exceeding 200 Mbps, allowing EV customers an alternate wired data connection to the cloud through the charging station. The introduction of the Ethernet digital interface, in addition to Serial Peripheral Interface (SPI), the AEC-Q100 Grade 2 compliance, and the HPAV operation mode, supports expanded design flexibility for future devices.
“By further expanding our PLC device portfolio, in addition to engineering the fully integrated, scalable Snapdragon Digital Chassis solution for automakers, Qualcomm Technologies is supporting an evolving automotive industry driven by the EV vehicle architecture,” said Lars Boeryd, Sr. Director Product Marketing, Automotive at Qualcomm Technologies, Inc. “As a leading supplier of PLC HPGP devices for smart-grid communications, we are committed to helping our customers succeed in a growing EV industry increasingly adopting the CCS standard.”
The QCA7006AQ is planned to be available for production by early Q4 2022, and samples are available today.
www.qualcomm.com
Smart-grid integration allows vehicles to seamlessly authenticate on the network through Plug and Charge automated payments for EV charging, coordinating the timing and direction of energy to and from the grid and home. Smart-grid charging applications supported by the CCS standard allows users the flexibility to choose optimal charging times and extract energy from their EVs as needed, supporting the growing need for EV charging while minimizing peak load power generation and distribution requirements.
This is Qualcomm Technologies’ first QCA700X PLC device designed to support an Ethernet digital interface and that is qualified to support an ambient operating temperature range of -40°C to +105°C (AEC-Q100 Automotive Grade 2). As an optional feature, the QCA7006AQ also supports HomePlug Audio Video (HPAV) streaming at PHY rate exceeding 200 Mbps, allowing EV customers an alternate wired data connection to the cloud through the charging station. The introduction of the Ethernet digital interface, in addition to Serial Peripheral Interface (SPI), the AEC-Q100 Grade 2 compliance, and the HPAV operation mode, supports expanded design flexibility for future devices.
“By further expanding our PLC device portfolio, in addition to engineering the fully integrated, scalable Snapdragon Digital Chassis solution for automakers, Qualcomm Technologies is supporting an evolving automotive industry driven by the EV vehicle architecture,” said Lars Boeryd, Sr. Director Product Marketing, Automotive at Qualcomm Technologies, Inc. “As a leading supplier of PLC HPGP devices for smart-grid communications, we are committed to helping our customers succeed in a growing EV industry increasingly adopting the CCS standard.”
The QCA7006AQ is planned to be available for production by early Q4 2022, and samples are available today.
www.qualcomm.com
