Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.
Infineon is expanding its XDP™ digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage digital hot-swap controller with a programmable safe operating area control designed for telecom infrastructure.
Diodes Incorporated introduces three new Hall-effect switches, the AH1899A/B/S, which operate from a low supply voltage and at extremely low quiescent current to extend battery lifetime in mobile and portable devices.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices.